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參數(shù)資料
| 型號： | MAX3736ETE |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 其它接口 |
| 英文描述： | 3.2Gbps, Low-Power, Compact, SFP Laser Driver |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, QCC16 |
| 封裝： | 3 X 3 MM, TQFN-16 |
| 文件頁數(shù)： | 9/11頁 |
| 文件大小： | 341K |
| 代理商： | MAX3736ETE |
Input Termination Requirements
The MAX3736 data inputs are SFP MSA compliant. On-
chip 100
, differential input impedance is provided for
optimal termination (Figure 5). Because of the on-chip
biasing network, the MAX3736 inputs self-bias to the
proper operating point to accommodate AC-coupling.
Applications Information
Data Input Logic Levels
The MAX3736 is directly compatible with +3.3V reference
CML. Either DC or AC-coupling can be used for CML ref-
erenced to +3.3V. For all other logic types, AC-coupling
should be used. DC coupling to CML is fine, but it
negates the squelching function on the modulation path.
Modulation Currents Exceeding 60mA
For applications requiring a modulation current greater
than 60mA, headroom is insufficient for proper operation
of the laser driver if the laser is DC-coupled. To avoid
this problem, the MAX3736 modulation output can be
AC-coupled to the cathode of a laser diode. An external
pullup inductor is necessary to DC-bias the modulation
output at V
CC
. Such a configuration isolates laser for-
ward voltage from the output circuitry and allows the out-
put at OUT+ to swing above and below the supply
voltage (V
CC
). When AC-coupled, the MAX3736 modula-
tion current can be programmed from 5mA to 85mA.
Refer to Maxim Application Note
HFAN 02.0: Interfacing
Maxim’s Laser Drivers to Laser Diodes
for more informa-
tion on AC-coupling laser drivers to laser diodes.
Interface Models
Figures 5 and 6 show simplified input and output cir-
cuits for the MAX3736 laser driver. If dice are used,
replace package parasitic elements with bondwire par-
asitic elements.
Wire-Bonding Die
The MAX3736 uses gold metalization with a thickness
of 5μm (typ). Maxim characterized this circuit with gold-
wire ball bonding (1-mil diameter wire). Die-pad size is
94 mils (2388μm) square, and die thickness is 15 mils
(381μm). Refer to Maxim Application Note
HFAN-
08.0.1: Understanding Bonding Coordinates and
Physical Die Size
for additional information.
Layout Considerations
To minimize loss and crosstalk, keep the connections
between the MAX3736 output and the laser as short as
possible. Use good high-frequency layout techniques
and multilayer boards with an uninterrupted ground
plane to minimize EMI and crosstalk.
M
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
_______________________________________________________________________________________
9
MAX3736
0.11pF
0.65nH
V
CC
V
CC
V
CC
0.11pF
0.65nH
IN+
IN-
PACKAGE
50
50
24k
16k
82pF
Figure 5. Simplified Input Circuit Schematic
0.11pF
PACKAGE
OUT-
0.11pF
0.43nH
0.43nH
OUT+
V
CC
MAX3736
Figure 6. Simplified Output Circuit Schematic
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3736ETE+ | 功能描述:激光驅動器 3.2Gbps Low-Power SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3736ETE+T | 功能描述:激光驅動器 3.2Gbps Low-Power SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3736ETE-T | 功能描述:激光驅動器 3.2Gbps Low-Power SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3736EVKIT | 功能描述:激光驅動器 3.2Gbps Low-Power Compact SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3737EGJ | 功能描述:激光驅動器 RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
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