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參數(shù)資料
| 型號： | MAX3736ETE |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 其它接口 |
| 英文描述： | 3.2Gbps, Low-Power, Compact, SFP Laser Driver |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, QCC16 |
| 封裝： | 3 X 3 MM, TQFN-16 |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 341K |
| 代理商： | MAX3736ETE |
M
Exposed-Pad Package
The exposed pad on the 16-pin QFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3736
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note
HFAN-08.1: Thermal
Considerations for QFN and Other Exposed-Pad
Packages
for additional information.
Laser Safety and IEC 825
Using the MAX3736 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Customers must determine the level of
fault tolerance required by their application. Please rec-
ognize that Maxim products are not designed or autho-
rized for use as components in systems intended for
surgical implant into the body, for applications intended
to support or sustain life, or for any other application
where the failure of a Maxim product could create a situ-
ation where personal injury or death may occur.
Chip Topography/
Pad Configuration
The origin for pad coordinates is defined as the bottom
left corner of the bottom left pad. All pad locations are
referenced from the origin, and indicate the center of
the pad where the bond wire should be connected.
Refer to Maxim Application Note
HFAN-08.0.1:
Understanding Bonding Coordinates and Physical Die
Size
for detailed information.
TRANSISTOR COUNT: 1385
PROCESS: SiGe BIPOLAR
SUBSTRATE CONNECTED TO GND
DIE THICKNESS: 15 mils
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
10
______________________________________________________________________________________
16
1
2
3
4
12
11
10
9
15
14
13
5
6
7
8
D
V
C
G
G
V
CC
OUT-
OUT+
V
CC
IN+
IN-
V
CC
THE EXPOSED PAD MUST BE CONNECTED TO GROUND
FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE
B
M
THIN QFN (3mm x 3mm)
B
B
V
CC
TOP VIEW
MA3736
GND
DIS
GND GND GND
V
CC
OUT-
OUT-
OUT+
OUT+
V
CC
BIAS
BC_MON
MODSET
1.55mm
(61mils)
1.14mm
(45mils)
BIASSET
V
CC
(0,0)
IN-
IN+
V
CC
V
CC
Chip Topography
Pin Configuration
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| MAX3737EGJ | Multirate Laser Driver with Extinction Ratio Control |
| MAX3740A | Full-Duplex LVDM Transceiver 8-MSOP -40 to 85 |
| MAX3740AETG | Full-Duplex LVDM Transceiver 8-SOIC -40 to 85 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3736ETE+ | 功能描述:激光驅(qū)動器 3.2Gbps Low-Power SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3736ETE+T | 功能描述:激光驅(qū)動器 3.2Gbps Low-Power SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3736ETE-T | 功能描述:激光驅(qū)動器 3.2Gbps Low-Power SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3736EVKIT | 功能描述:激光驅(qū)動器 3.2Gbps Low-Power Compact SFP Laser Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3737EGJ | 功能描述:激光驅(qū)動器 RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
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