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參數(shù)資料
| 型號： | MAX3669 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Single LVDS Transmitter 8-SOIC -40 to 85 |
| 中文描述： | +3.3V、622Mbps、 SDH/SONET激光驅(qū)動器，帶有電流監(jiān)測和自動功率控制 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 758K |
| 代理商： | MAX3669 |
M
+3.3V, 622Mbps SDH/SONET
Laser Driver with Current Monitors and APC
______________________________________________________________________________________
11
V
CC
BIASMAX
MODSET
GND
APCSET
N.C.
GND
N
V
C
M
V
C
V
C
0.083"
(2.10mm)
0.070"
(1.78mm)
V
C
GND
V
CC
CAPC
N.C.
GND
N.C.
GND
ENABLE
N.C.
GND
N.C.
V
CC
BIAS
GND
N.C.
N.C.
GND
V
CC
FAIL
G
G
M
G
N
O
B
G
D
D
V
C
V
C
G
O
G
N
Chip Topography
MAX3669
TQFP
TOP VIEW
32
28
29
30
31
25
26
27
M
G
A
N
B
N
N
C
10
13
15
14
16
11
12
9
E
F
G
N
N
V
C
G
B
17
18
19
20
21
22
23 MD
24 V
CC
GND
GND
V
CC
OUT-
OUT+
V
CC
2
3
4
5
6
7
8
MODMON
BIASMON
V
CC
GND
DATA-
DATA+
V
CC
1
V
CC
At +5V power supply, the headroom voltage for the
MAX3669 is significantly improved. In this case, it is
possible to achieve a modulation current of more than
50mA (using resistor pull-ups as shown in the
Typical
Operating Circuit
). The MAX3669 can also be DC-coupled
to a laser diode when operating at +5V supply; the volt-
age at OUT+ should be
≥
2.0V for proper operation.
Wire Bonding Die
For high current density and reliable operation, the
MAX3669 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100μm) square, and die thickness is 12
mils (300μm) mils.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3669 output pins and LD as close as possible.
Optimize the laser diode performance by placing a
bypass capacitor as close as possible to the laser
anode. Use good high-frequency layout techniques
and multilayer boards with uninterrupted ground planes
to minimize EMI and crosstalk.
Laser Safety and IEC 825
Using the MAX3669 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Customers must determine the level of
fault tolerance required by their application, recognizing
that Maxim products are not designed or authorized for
use as components in systems intended for surgical
implant into the body, for applications intended to sup-
port or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
Pin Configuration
Chip Information
TRANSISTOR COUNT: 1525
SUBSTRATE CONNECTED TO GND
相關(guān)PDF資料 |
PDF描述 |
|---|---|
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| MAX3675EHJ | 622Mbps, Low-Power, 3.3V Clock-Recovery and Data-Retiming IC with Limiting Amplifier |
| MAX3675 | 622Mbps, Low-Power, 3.3V Clock-Recovery and Data-Retiming IC with Limiting Amplifier |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3669E/D | 功能描述:激光驅(qū)動器 DICE SALES DICE12 RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3669E/D DIE | 制造商:Maxim Integrated Products 功能描述: |
| MAX3669E/D+ | 功能描述:激光驅(qū)動器 RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3669EHJ | 功能描述:激光驅(qū)動器 3.3V 622Mbps SDH/SONET RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3669EHJ+ | 功能描述:激光驅(qū)動器 3.3V 622Mbps SDH/SONET RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
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