參數(shù)資料
型號(hào): MAX3664ESA+T
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 12/12頁(yè)
文件大小: 0K
描述: IC PREAMP 622MBPS ULP 3.3V 8SOIC
標(biāo)準(zhǔn)包裝: 2,500
類(lèi)型: 轉(zhuǎn)阻前置放大器
應(yīng)用: 光纖學(xué)網(wǎng)絡(luò)
安裝類(lèi)型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 帶卷 (TR)
MAX3664
622Mbps, Ultra-Low-Power, 3.3V
Transimpedance Preamplifier for SDH/SONET
_______________________________________________________________________________________
9
INREF1 and INREF2
Connect INREF1 and INREF2 as close to the AC
ground of the photodetector diode as possible. The
photodetector AC ground is usually the ground of the
filter capacitor from the photodetector anode. The total
loop (from INREF1/INREF2, through the bypass capaci-
tor and the diode, and back to IN) should be no more
than 2 cm. long.
Wire Bonding
For high current density and reliable operation, the
MAX3664 uses gold metallization. Make connections to
the die with gold wire only, and use ball bonding tech-
niques (wedge bonding is not recommended). Die-pad
size is 4 mils square, with a 6 mil pitch. Die thickness is
12 mils.
VCC and Ground
Use good high-frequency design and layout tech-
niques. The use of a multilayer circuit board with sepa-
rate ground and VCC planes is recommended. Take
care to bypass VCC and to connect the GND pin to the
ground plane with the shortest possible traces.
FILTER
CAP
OUT+
OUT-
OUT+
OUT-
IN
COMP
VCC
PIN DIODE
Figure 4. Suggested Layout for TO-46 Header
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