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參數(shù)資料
| 型號： | MAX3421EETJ+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 25/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC USB PERIPH/HOST CNTRL 32TQFN |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 60 |
| 控制器類型： | USB 外設控制器 |
| 接口： | USB/串行 |
| 電源電壓： | 3 V ~ 3.6 V |
| 電流 - 電源： | 15mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-WFQFN 裸露焊盤 |
| 供應商設備封裝： | 32-TQFN-EP（5x5） |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 1407 (CN2011-ZH PDF) |
| 配用： | MAX3421EVKIT-1+-ND - EVAL KIT FOR MAX3421E |
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MAX3421E
USB Peripheral/Host Controller
with SPI Interface
6
Maxim Integrated
Pin Description (continued)
PIN
NAME
INPUT/
OUTPUT
FUNCTION
21
D+
Input/
Output
USB D+ Signal. Connect D+ to a USB connector through a 33
Ω ±1% series resistor. A
switchable 1.5k
Ω D+ pullup resistor and 15kΩ D+ pulldown resistor is internal to the device.
22
VBCOMP
Input
VBUS Comparator Input. VBCOMP is internally connected to a voltage comparator to allow the
SPI master to detect (through an interrupt or checking a register bit) the presence or loss of
power on VBUS. Bypass VBCOMP to ground with a 1.0F ceramic capacitor. VBCOMP is pulled
down to ground with RIN (see Electrical Characteristics).
23
VCC
Input
USB Transceiver and Logic Core Power-Supply Input. Connect VCC to a positive 3.3V power
supply. Bypass VCC to ground with a 1.0F ceramic capacitor as close to the VCC pin as possible.
24
XI
Input
Crystal Oscillator Input. Connect XI to one side of a parallel resonant 12MHz ±0.25% crystal
and a load capacitor to GND. XI can also be driven by an external clock referenced to VCC.
25
XO
Output
Crystal Oscillator Output. Connect XO to the other side of a parallel resonant 12MHz ±0.25% crystal
and a load capacitor to GND. Leave XO unconnected if XI is driven with an external source.
26
GPIN0
27
GPIN1
28
GPIN2
29
GPIN3
30
GPIN4
31
GPIN5
32
GPIN6
Input
General-Purpose Inputs. GPIN7–GPIN0 are connected to VL with internal pullup resistors.
GPIN7–GPIN0 logic levels are referenced to the voltage on VL.
—
EP
Input
Exposed Pad, Connected to Ground. Connect EP to GND or leave unconnected. EP is located on
the bottom of the TQFN package. The TQFP package does not have an exposed pad.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3421EETJ+ | 功能描述:外圍驅(qū)動器與原件 - PCI USB Peripheral Controller w/SPI RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| MAX3421EETJ+T | 功能描述:外圍驅(qū)動器與原件 - PCI USB Peripheral Controller w/SPI RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| MAX3421EVKIT-1+ | 功能描述:界面開發(fā)工具 MAX3421E/20E Eval Kit RoHS:否 制造商:Bourns 產(chǎn)品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V |
| MAX3430CPA | 功能描述:RS-485接口IC RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:250 Kbps 工作電源電壓:3.3 V 電源電流:750 uA 工作溫度范圍:- 40 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| MAX3430CPA+ | 功能描述:RS-485接口IC Fail-Safe 1/4-Unit 3.3V Transceiver RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:250 Kbps 工作電源電壓:3.3 V 電源電流:750 uA 工作溫度范圍:- 40 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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