參數(shù)資料
型號: MAX2022EVKIT
廠商: Maxim Integrated Products, Inc.
英文描述: Evaluation Kit
中文描述: MAX2022評估板
文件頁數(shù): 4/8頁
文件大?。?/td> 236K
代理商: MAX2022EVKIT
E
Layout Considerations
The MAX2022 evaluation board can be a guide for your
board layout. Pay close attention to thermal design and
close placement of components to the IC. The
MAX2022’s package exposed paddle (EP) conducts
heat from the device and provides a low-impedance
electrical connection to the ground plane. The EP must
be attached to the PCB ground plane with a low ther-
mal and electrical impedance contact. Ideally, this is
achieved by soldering the backside of the package
directly to a top metal ground plane on the PCB.
Alternatively, the EP can be connected to an internal or
bottom-side ground plane using an array of plated vias
directly below the EP. The MAX2022 EV kit uses nine
evenly spaced 0.016in-diameter, plated through holes
to connect the EP to the lower ground planes.
Depending on the ground plane spacing, large sur-
face-mount pads in the IF path may need to have the
ground plane relieved under them to reduce parasitic
shunt capacitance.
MAX2022 Evaluation Kit
4
_______________________________________________________________________________________
C = 10pF
C = 15pF
100
C = 15pF
100
C = 10pF
L = 15nH
C = 10pF
C = 15pF
100
C = 15pF
100
C = 10pF
L = 15nH
MAX2022
RF MODULATOR
0
°
90
°
LO
Q
I
Figure 1. Diplexer Network
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