V
參數(shù)資料
型號： MAX14821ETG+
廠商： Maxim Integrated Products
文件頁數(shù)： 23/31頁
文件大?。?/td> 0K
描述： IC IO-LINK 24-TQFN
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 25
系列： *
MAX14821
IO-Link Device Transceiver
3
Maxim Integrated
(All voltages referenced to GND, unless otherwise noted.)
VCC.........................................................................-40V to +40V
VP (IVP < 50mA) ..... the higher of -0.3V and (VCC - 1V) to +40V
LDOIN....................................................................-0.3V to +40V
V5..................... -0.3V to the lesser of (VLDOIN + 0.3V) and +6V
LDO33 ..................... -0.3V to the lesser of (V5 + 0.3V) and +6V
VL.............................................................................-0.3V to +6V
DI ...........................................................................-40V to +40V
C/Q, DO...................... MIN: the higher of -40V and (VCC - 40V)
MAX: the lesser of +40V and (VCC + 40V)
Logic Inputs
TXC, TXQ, TXEN, LO, CS, SDI, SCLK..... -0.3V to (VL + 0.3V)
Logic Outputs
RX, WU, LI, SDO, IRQ ............................. -0.3V to (VL + 0.3V)
UV........................................................................-0.3V to +6V
Continuous Current Into Any Logic Pin........................... Q50mA
Continuous Power Dissipation
TQFN (derate 27.8mW/NC above +70NC)..................2222mW
WLP (derate 22.7mW/NC above +70NC)....................1816mW
Operating Temperature Range.......................... -40NC to +85NC
Maximum Junction Temperature.....................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (TQFN only; soldering, 10s) .............+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ..........36NC/W
Junction-to-Case Thermal Resistance (BJC) .................3NC/W
WLP
Junction-to-Ambient Thermal Resistance (BJA) ..........44NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
DC ELECTRICAL CHARACTERISTICS
(VCC = 18V to 36V, VL = 2.3V to 5.5V, VGND = 0V; all logic inputs at VL or GND; TA = -40NC to +85NC, unless otherwise noted. Typical
values are at VCC = 24V, VL = 3.3V, and TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC Supply Voltage
VCC
For driver operation
9
36
V
VCC Supply Current
ICC
VCC = 24V, C/Q as input, no load on V5
or LDO33, LDOIN not connected to VP,
VLDOIN = 24V
1
2.5
mA
VCC Undervoltage-Lockout
Threshold
VCCUVLO
VCC falling
6
7.4
9
V
VCC Undervoltage-Lockout
Threshold Hysteresis
VCCUVLO_HYST
200
mV
V5 Supply Current
I5_IN
LDOIN shorted to V5, external 5V applied
to V5, no switching, LDO33 disabled
3
mA
V5 Undervoltage-Lockout
Threshold
V5UVLO
V5 falling
2.0
V
VL Logic-Level Supply Voltage
VL
2.3
5.5
V
VL Logic-Level Supply Current
IL
All logic inputs at VL or GND
5
F
A
VL Undervoltage Threshold
VLUVLO
VL falling
0.65
0.95
1.30
V
5V LDO (V5)
LDOIN Input Voltage Range
VLDOIN
7
36
V
LDOIN Supply Current
ILDOIN
VLDOIN = 24V, C/Q is configured as an
input, no load on V5 or LDO33
2.5
5
mA
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