M
+2.7V, Low-Power, 2-Channel, 108ksps,
S erial 12-Bit ADCs in 8-Pin μMAX
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
DD
to GND..............................................................-0.3V to +6V
CH0, CH1 (CH+, CH-) to GND ................. -0.3V to (V
DD
+ 0.3V)
REF to GND .............................................. -0.3V to (V
DD
+ 0.3V)
Digital Inputs to GND. ............................................. -0.3V to +6V
DOUT to GND............................................ -0.3V to (V
DD
+ 0.3V)
DOUT Sink Current ........................................................... 25mA
Continuous Power Dissipation (T
A
= +70°C)
μMAX (derate 4.1mW/°C above +70°C) .................... 330mW
ELECTRICAL CHARACTERISTICS
(V
DD
= +2.7V to +5.25V, V
REF
= 2.5V, 0.1μF capacitor at REF, f
SCLK
= 2.17MHz, 16 clocks/conversion cycle (108ksps),
CH- = GND for MAX145, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Plastic DIP (derate 9.09mW/°C above +70°C) ............727mW
CERDIP (derate 8.00mW/°C above +70°C) ............... 640mW
Operating Temperature Ranges (T
A
)
MAX144/MAX145_C_A .......................................0°C to +70°C
MAX144/MAX145_E_A. ...................................-40°C to +85°C
MAX144/MAX145_M_A ................................ -55°C to +125°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10sec) .............................+300°C
MAX14_A
MAX14_B
No missing codes over temperature
CONDITIONS
LSB
±0.5
±1
±0.75
±3
INL
Relative Accuracy (Note 2)
Bits
12
RES
Resolution
LSB
LSB
DNL
Differential Nonlinearity
Offset Error
Gain Error (Note 3)
UNITS
MIN
TYP
MAX
SYMBOL
PARAMETER
ppm/°C
±0.8
Gain Temperature Coefficient
LSB
±3
LSB
±0.05
Channel-to-Channel Offset
Matching
LSB
±0.05
Channel-to-Channel Gain
Matching
-3dB rolloff
f
IN
= 65kHz, V
IN
= 2.5Vp-p (Note 4)
External clock, f
SCLK
= 2.17MHz,
16 clocks/conversion cycle
MHz
1.0
Full-Power Bandwidth
CONVERSION RATE
MHz
2.25
dB
-85
Channel-to-Channel Crosstalk
Small-Signal Bandwidth
μs
7.4
t
CONV
Conversion Time (Note 5)
Total Harmonic Distortion
(including 5th-order harmonic)
dB
70
SINAD
Signal-to-Noise Plus
Distortion Ratio
dB
-80
THD
dB
80
SFDR
Spurious-Free Dynamic Range
Internal clock mode, for data transfer only
External clock mode
Internal clock
0
5
MHz
0.1
2.17
f
SCLK
ps
<50
Aperture J itter
Serial Clock Frequency
5
7
μs
ns
2.5
t
ACQ
T/H Acquisition Time
Aperture Delay
25
DC ACCURACY
(Note 1)
DYNAMIC SPECIFICATIONS
(f
IN(sine-wave)
= 10kHz, V
IN
= 2.5Vp-p, 108ksps, f
SCLK
= 2.17MHz, CH- = GND for MAX145)