參數(shù)資料
型號(hào): MAX1426EAI+T
廠商: Maxim Integrated Products
文件頁數(shù): 9/16頁
文件大?。?/td> 0K
描述: IC ADC 10BITS 10MSPS 28SSOP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,000
位數(shù): 10
采樣率(每秒): 10M
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 210mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 28-SSOP
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個(gè)差分,雙極
MAX1426
10-Bit, 10Msps ADC
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = VCMLP = +5V, VDVDD = +3.3V, VCMLN = VAGND = VDGND = 0V, internal reference, digital output loading 35pF, fCLK =
10MHz (50% duty cycle), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................ -0.3V to +6V
DVDD to DGND ....................................................... -0.3V to +6V
AVDD to DGND ........................................................ -0.3V to +6V
DGND to AGND ................................................................. ±0.3V
REFP, REFIN, REFN, CMLN, CMLP,
CML, INP, INN .....................(VAGND - 0.3V) to (VAVDD + 0.3V)
CLK, OE/PD, D0–D9 ...............(VDGND - 0.3V) to (VDVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
28-Pin SSOP (derated 9.5mW/°C above +70°C) .........762mW
Operating Temperature Ranges
MAX1426CAI ..................................................... 0°C to +70°C
MAX1426EAI................................................... -40°C to +85°C
Maximum Junction Temperature .................................... +150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
58
60
f = 2MHz
-70
-67
f = 2MHz
%FSR
f = 2MHz
(Note 4)
External reference (REFP, CML, REFN)
(Note 3)
External reference (REFIN) (Note 2)
Guaranteed monotonic
(Note 1)
Internal reference (Note 1)
f = 2MHz
CONDITIONS
SINAD
Signal-to-Noise and Distortion
dB
THD
Total Harmonic Distortion
(first five harmonics)
dB
69
72
SFDR
Spurious-Free Dynamic Range
dB
60
61
SNR
Signal-to-Noise Ratio
LSB
-1
1
DNL
Differential Nonlinearity
Bits
10
RES
Resolution
mV/V
-5
±2
+5
PSRR
Power-Supply Rejection Ratio
-5
±3
5
-5
±2
5
LSB
-1.5
±0.3
1.5
INL
Integral Nonlinearity
No Missing Codes
-3
±1.0
3
MSO
Midscale Offset
-10
±5
10
GE
Gain Error
UNITS
MIN
TYP
MAX
SYMBOL
PARAMETER
dB
ACCURACY
DYNAMIC PERFORMANCE (AIN = -1.0dBFS)
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