
RS-485 Transceivers with Low-Voltage
Logic Interface
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = +3V to +5.5V, VL = +1.8V to VCC, TA = -40掳C to +85掳C, unless otherwise noted. Typical values are VCC = +5V, VL = +1.8V at
TA = +25掳C.) (Notes 2, 3)
Stresses beyond those listed under 鈥淎bsolute Maximum Ratings鈥� may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
(All voltages referenced to GND.)
Supply Voltage (VCC) ...............................................-0.3V to +6V
Logic Supply Voltage (VL ) ......................................-0.3V to +6V
Control Input Voltage (RE) .............................-0.3V to (VL+0.3V)
Control Input Voltage (DE) ......................................-0.3V to +6V
Driver Input Voltage (DI) ..........................................-0.3V to +6V
Driver Output Voltage (Y, Z, A, B) ............................-8V to +13V
Receiver Input Voltage (A, B)
(MAX13430E/MAX13431E)....................................-8V to +13V
Receiver Input Voltage (A, B)
(MAX13432E/MAX13433E)..................................-25V to +25V
Receiver Output Voltage (RO) .....................-0.3V to (VL + 0.3V)
Driver Output Current ....................................................卤250mA
Short-Circuit Duration (RO, A, B) to GND .................Continuous
Power Dissipation (TA = +70掳C)
10-Pin MAX (derate 8.8mW/掳C above +70掳C) ..........707mW
10-Pin TDFN (derate 24.4mW/掳C above +70掳C) ......1951mW
14-Pin TDFN (derate 24.4mW/掳C above +70掳C) ......1951mW
14-Pin SO (derate 11.9mW/掳C above +70掳C) .............952mW
Junction-to-Ambient Thermal Resistance (
胃JA) (Note 1)
10-Pin MAX ...........................................................113.1掳C/W
10-Pin TDFN .................................................................41掳C/W
14-Pin TDFN ................................................................41掳C/W
14-Pin SO ....................................................................84掳C/W
Junction-to-Ambient Thermal Resistance (
胃JC) (Note 1)
10-Pin MAX ................................................................42掳C/W
10-Pin TDFN ...................................................................9掳C/W
14-Pin TDFN ..................................................................8掳C/W
14-Pin SO ....................................................................34掳C/W
Operating Temperature Range ...........................-40掳C to +85掳C
Junction Temperature ..................................................... +150掳C
Storage Temperature Range .............................-65掳C to +150掳C
Lead Temperature (soldering, 10s) .................................+300掳C
Soldering Temperature (reflow) .......................................+260掳C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
VCC Supply-Voltage Range
VCC
3
5.5
V
VL Supply-Voltage Range
VL
1.62
VCC
V
ICC Supply Current
ICC
DE = RE = high, no load
DE = RE = low, no load
DE = high, RE = low, no load
2mA
ICC Supply Current in Shutdown
Mode
ISHDN
DE = low, RE = high, no load
10
A
VL Supply Current
IL
RO = no load
1
A
DRIVER
RL = 100
惟, VCC = +3V
2
VCC
RL = 54
惟, VCC = +3V
1.5
VCC
RL = 100
惟, VCC = +4.5V
2.25
VCC
Differential Driver Output
(Figure 1)
VOD
RL = 54
惟, VCC = +4.5V
2.25
VCC
V
Change in Magnitude of
Differential Output Voltage
螖VOD
RL = 100
惟 or 54惟, Figure 1 (Note 4)
0.2
V
Driver Common-Mode Output
Voltage
VOC
RL = 100
惟 or 54惟, Figure 1
VCC/2
3
V
Change in Magnitude of
Common-Mode Voltage
螖VOC
RL = 100
惟 or 54惟, Figure 1 (Note 4)
0.2
V
MAX13430E鈥揗AX13433E
2
Maxim Integrated