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參數(shù)資料
| 型號： | MAX13331GEE/V+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 2/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP STEREO HEADPHONE 16-QSOP |
| 其它有關(guān)文件： | Automotive Product Guide |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 系列： | DirectDrive® |
| 類型： | AB 類 |
| 輸出類型： | 耳機，2-通道（立體聲） |
| 在某負載時最大輸出功率 x 通道數(shù)量： | 135mW x 2 @ 32 歐姆 |
| 電源電壓： | 4 V ~ 5.5 V |
| 特點： | 消除爆音，短路保護，關(guān)機 |
| 安裝類型： | 表面貼裝 |
| 供應(yīng)商設(shè)備封裝： | 16-QSOP |
| 封裝/外殼： | 16-SSOP（0.154"，3.90mm 寬） |
| 包裝： | 帶卷 (TR) |
MAX13330/MAX13331
Automotive DirectDrive Headphone Amplifiers
with Output Protection and Diagnostics
10
______________________________________________________________________________________
Diagnostic Output
The MAX13330/MAX13331 provides an analog diag-
nostic output as a fraction of the analog supply voltage
VDD. The voltage at DIAG will correspond to the fault
condition with the highest priority that is present in the
system, as shown in Table 1. When simultaneous fault
conditions occur on both headphone outputs, the diag-
nostic output will only report the fault condition at OUTR
until it is cleared or removed. Only then will the fault
condition at OUTL be reported at DIAG. Connect DIAG
to a high-impedance input.
For both headphone outputs, short circuits to VBAT are
dynamic and VDIAG will be automatically cleared as
soon as the fault condition is removed. Short circuits to
GND occurring when a positive output voltage is pre-
sent on OUTL or OUTR, will result in VDIAG being
latched until the fault condition is cleared.
When VDIAG is latched, it can be cleared by either tog-
gling SHDN low for less than 5s or initiating a full reset
of the MAX13330/MAX13331. Toggling SHDN low for
less than 5s will cause the fault to ground to be
cleared without shutting down the device or interrupting
the output state of the amplifiers. A full reset requires
SHDN to be pulled low for more than 50s. The amplifi-
er outputs will enter high impedance and remain in that
state until the device exits shutdown.
Click-and-Pop Suppression
In conventional single-supply audio amplifiers, the out-
put-coupling capacitor is a major contributor of audible
clicks and pops. Upon startup, the amplifier charges
the coupling capacitor to its bias voltage, typically half
the supply. Likewise, on shutdown, the capacitor is dis-
charged to SGND. This results in a DC shift across the
capacitor which appears as an audible transient at the
speaker. Since the MAX13330/MAX13331 does not
require output-coupling capacitors, this problem does
not arise.
Additionally, the MAX13330/MAX13331 feature exten-
sive click-and-pop suppression that eliminates any
audible transient sources internal to the device. The
Power-Up/-Down Transient graph in the
Typical
Operating Characteristics shows that there is minimal
DC shift and no spurious transients at the output upon
startup or shutdown.
In most applications, the output of the preamplifier dri-
ving the MAX13330/MAX13331 has a DC bias of typi-
cally half the supply. At startup, the input-coupling
capacitor is charged to the preamplifier’s DC-bias volt-
age through the feedback resistor of the MAX13330/
MAX13331, resulting in a DC shift across the capacitor
and an audible click/pop. Delaying the rise of SHDN 4
to 5 time constants (80ms to 100ms) based on RIN and
CIN relative to the startup of the preamplifier, eliminates
this click/pop caused by the input filter.
Shutdown
The MAX13330/MAX13331 feature shutdown control
allowing audio signals to be shut down or muted.
Driving SHDN low disables the amplifiers and the
charge pump, sets the amplifier output impedance to
14k
Ω (typ), and reduces the supply current. In shut-
down mode, the supply current is reduced to 2A. The
charge pump is enabled once SHDN is driven high.
Applications Information
Power Dissipation
Under normal operating conditions, linear power ampli-
fiers can dissipate a significant amount of power. The
maximum power dissipation for each package is given
in the
Absolute Maximum Ratings section under contin-
uous power dissipation or can be calculated by the
following equation:
where TJ(MAX) is +145°C, TA is the ambient tempera-
ture, and
θJA is the reciprocal of the derating factor in
°C/W as specified in the
Absolute Maximum Ratings
section. The thermal resistance
θJA of the QSOP pack-
age is 120°C/W.
The MAX13330/MAX13331 have two power dissipation
sources: the charge pump and two amplifiers. If power
dissipation for a given application exceeds the maxi-
mum allowed for a particular package, either reduce
VDD, increase load impedance, decrease the ambient
temperature, or add heatsinking to the device. Large
output, supply, and ground traces improve the maxi-
mum power dissipation in the package.
P
TT
DISSPKG MAX
JMAX
A
JA
()
=
θ
VDIAG
STATE
PRIORITY
VDD
OUTL Short to VBAT
3
3/4 VDD
OUTR Short to VBAT
1
1/2 VDD
OUTL Short to SGND
4
1/4 VDD
OUTR Short to SGND
2
0
No Fault
5
Three State
Shutdown
—
Table 1. MAX13330/MAX13331 Diagnostic
Priority
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX13335EEVKIT# | 功能描述:放大器 IC 開發(fā)工具 MAX13335E Eval Kit RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| MAX13335EEVKIT+ | 功能描述:放大器 IC 開發(fā)工具 MAX13335E Eval Kit RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| MAX13335EGEE/V+ | 功能描述:音頻放大器 Differential Audio Input Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX13335EGEE/V+T | 功能描述:音頻放大器 Differential Audio Input Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX13336EGEE/V+ | 功能描述:音頻放大器 Differential Audio Input Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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