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參數(shù)資料
| 型號： | MAX13003EEUE+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 10/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC LEVEL TRANS 6CH 16-TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 邏輯功能： | 變換器，雙向 |
| 位數(shù)： | 6 |
| 輸入類型： | CMOS |
| 輸出類型： | CMOS |
| 數(shù)據(jù)速率： | 20Mbps |
| 通道數(shù)： | 1 |
| 輸出/通道數(shù)目： | 6 |
| 差分 - 輸入:輸出： | 無/無 |
| 傳輸延遲（最大）： | 15ns |
| 電源電壓： | 1.5 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 帶卷 (TR) |
MAX13000E–MAX13005E
IEC 61000-4-2 Standard ESD Protection
The IEC 61000-4-2 standard (Figure 12) specifies ESD
tolerance for electronic systems. The IEC61000-4-2
model specifies a 150pF capacitor that is discharged
into the device through a 330
Ω resistor. The
MAX13000E–MAX13005E’s I/O on the VCC side are
rated for IEC 61000-4-2 standard, (8kV Contact
Discharge and ±10kV Air-Gap Discharge).
The IEC 61000-4-2 model discharges higher peak cur-
rent and more energy than the HBM due to the lower
series resistance and larger capacitor.
Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of transmitting incor-
rect data, bypass VL and VCC to ground with a 0.1F
capacitor. To ensure full ±15kV ESD protection, bypass
VCC to ground with a 1F capacitor. Place all capaci-
tors as close to the power-supply inputs as possible.
UCSP Package Considerations
For general UCSP package information and PC layout
considerations, please refer to Maxim application note:
Wafer-Level Chip-Scale Package.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical relia-
bility tests. UCSP reliability is integrally linked to the
user’s assembly methods, circuit board material, and
usage environment. The user should closely review
these areas when considering use of a UCSP package.
Performance through Operating Life Test and Moisture
Resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Information on Maxim’s qualification plan, test
data, and recommendations are detailed in the UCSP
application note, which can be found on Maxim’s web-
site at www.maxim-ic.com.
Ultra-Low-Voltage Level Translators
18
______________________________________________________________________________________
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
RC 1M
Ω
RD 1500
Ω
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
CS
100pF
Figure 10. Human Body ESD Test Model
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50
Ω TO 100Ω
RD
330
Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 12. IEC 61000-4-2 Contact Discharge Test Model
100%
90%
36.8%
tRL
tDL
TIME
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
10%
0
AMPERES
IP
Ir
Figure 11. Human Body Current Waveform
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX13004EBE | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX13004EBE-T | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX13004EEBE | 制造商:Maxim Integrated Products 功能描述:ULTRA-LOW-VOLTAGE LEVEL TRANSLATORS - Rail/Tube |
| MAX13004EEBE-T | 功能描述:轉(zhuǎn)換 - 電壓電平 RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MAX13004EEUE | 功能描述:轉(zhuǎn)換 - 電壓電平 RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
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