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參數(shù)資料
| 型號： | MAG-725M4 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Agilent MGA-725M4 Low Noise Amplifier with Bypass Switch In Miniature Leadless Package |
| 中文描述： | 安捷倫的MGA - 725M4低噪聲放大器，具有旁路開關(guān)在微型無鉛封裝 |
| 文件頁數(shù)： | 19/21頁 |
| 文件大?。?/td> | 404K |
| 代理商： | MAG-725M4 |
semiconductor wafers. The data
derived from product character-
ization tends to be normally
distributed, e.g., fits the standard
bell curve.
Parameters considered to be the
most important to system perfor-
mance are bounded by minimum
or maximum values. For the
MGA-725M4, these parameters
are: V
c test
, NF
test
, G
a test
, IIP3
test
,
and IL
test
. Each of the guaranteed
parameters is 100% tested as part
of normal manufacturing and test
process.
Values for most of the parameters
in the table of Electrical Specifica-
tions that are described by typical
data are mathematical mean (
μ
), of
the normal distribution taken from
the characterization data. For
parameters where measurements
of mathematical averaging may not
be practical, such as S-parameters
or Noise Parameters and the
performance curve, the data
represents a nominal part taken
from the center of the character-
ization distribution. Typical values
are intended to be used as a basis
for electrical design.
To assist designers in optimizing
not only the immediate amplifier
circuit using the MGA-725M4, but
to also evaluate and optimize
trade-offs that affect a complete
wireless system, the standard
deviation (
σ
) is provided for many
of the Electrical Specification
parameters (at 25
°
C). The stan-
dard deviation is a measure of
variability about the mean. It will
be recalled that a normal distribu-
tion is completely described by
the mean and standard deviation.
Standard statistics tables or
calculations provide the probabil-
ity of a parameter falling between
any two values, usually symmetri-
cally located about the mean.
Referring to Figure 15 for ex-
ample, the probability of a param-
eter being between
±
1
σ
is 68.3%;
between
±
2
σ
is 95.4%; and
between
±
3
σ
is 99.7%.
68%
95%
99%
Parameter Value
Mean (
μ
)
(typical)
-3
σ
-2
σ
-1
σ
+1
σ
+2
σ
+3
σ
Figure 15. Normal Distribution Curve.
Phase Reference Planes
The positions of the reference
planes used to specify S-param-
eters and Noise Parameters for the
MGA-725M4 are shown in Fig-
ure 16. As seen in the illustration,
the reference planes are located at
centre of package solder pads.
S and Noise Parameter data was
taken with the package mounted
to 50 ohm lines on 10 mil alumina
substrates, and the ground pads
were connected directly to the
substrate ground plane through a
solid metal rib. Designers should
include the parasitics of the
grounding system used in their
application.
Bottom View
Reference
Planes
Figure 16. Phase Reference Planes.
SMT Assembly
The package can be soldered
using either lead-bearing or lead-
free alloys. Reliable assembly of
surface mount components is a
complex process that involves
many material, process, and
equipment factors, including:
method of heating (e.g. IR or
vapor phase reflow, wave solder-
ing, etc) circuit board material,
conductor thickness and pattern,
type of solder alloy, and the
thermal conductivity and thermal
mass of components. Components
with a low mass, such as the
Minipak 1412 package, will reach
solder reflow temperatures faster
than those with a greater mass.
The MGA-725M4 has been quali-
fied to the time-temperature
profile shown in Figure 17. This
profile is representative of an IR
reflow type of surface mount
assembly process. After ramping
up from room temperature, the
circuit board with components
attached to it (held in place with
solder paste) passes through one
or more preheat zones. The
preheat zones increase the
temperature of the board and
components to prevent thermal
shock and begin evaporating
solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
max
) should not
exceed 235
°
C.
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