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參數(shù)資料
| 型號(hào)： | MA4AGBLP912 |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | ROHS COMPLIANT PACKAGE-2 |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大小： | 94K |
| 代理商： | MA4AGBLP912 |
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
AlGaAs
RoHS Compliant
Beamlead PIN Diode
M/A-COMProducts
Rev. 2
MA4AGBLP912
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Handling and Assembly Procedures
The following precautions should be observed to avoid damaging these devices.
Cleanliness
These devices should be handled in a clean environment.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are Class 1 ESD sensitive and can be damaged by static
electricity. Proper ESD techniques should be used when handling these devices.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the
anode air bridge. Beam lead devices must, however, be handled with extreme care since the leads
may easily be distorted or broken by the normal pressures exerted when handled with tweezers. A
vacuum pencil with a #27 tip is recommended for picking and placing.
Attachment
These devices were designed to be inserted onto hard or soft substrates. Recommended methods
of attachment include thermo-compression bonding, parallel-gap welding and electrically conductive
silver epoxy.
See Application Note M541 page 8,
Bonding and Handling and Procedures for Chip Diode Devices
for more detailed assembly instructions.
Ordering Information
Part Number
Packaging
MA4AGBLP912
Gel Pak
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