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參數(shù)資料
| 型號： | M393T6450FZA-D5 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC |
| 中文描述： | 注冊的DDR2 SDRAM內(nèi)存模塊240針腳注冊模塊，基于256Mb的F -死72位ECC |
| 文件頁數(shù)： | 4/18頁 |
| 文件大小： | 387K |
| 代理商： | M393T6450FZA-D5 |
Rev. 1.3 Aug. 2005
256MB, 512MB Registered DIMMs
DDR2 SDRAM
Input/Output Functional Description
Symbol
Type
Function
CK0
Input
Positive line of the differential pair of system clock inputs that drives input to the on-DIMM PLL.
CK0
Input
Negative line of the differential pair of system clock inputs that drives the input to the on-DIMM PLL.
CKE0~CKE1
Input
Activates the SDRAM CK signal when high and deactivates the CK signal when low. By deactivating the clocks, CKE low
initiates the Power Down mode, or the Self Refresh mode.
S0~S1
Input
Enables the associated SDRAM command decoder when low and disables decoder when high. When decoder is dis-
abled, new commands are ignored but previous operations continue.
These input signals also disable all outputs (except CKE and ODT) of the register(s) on the DIMM when both inputs are
high.
ODT0~ODT1
Input
I/O bus impedance control signals.
RAS, CAS, WE
Input
When sampled at the positive rising edge of the clock, CAS, RAS, and WE define the operation to be executed by the
SDRAM.
V
REF
Supply
Reference voltage for SSTL_18 inputs
V
DDQ
Supply
Isolated power supply for the DDR SDRAM output buffers to provide improved noise immunity
BA0~BA1
Input
Selects which SDRAM bank of four is activated.
A0~A9,A10/AP
A11~A12
Input
During a Bank Activate command cycle, Address defines the row address.
During a Read or Write command cycle, Address defines the column address. In addition to the column address, AP is
used to invoke autoprecharge operation at the end of the burst read or write cycle. If AP is high, autoprecharge is
selected and BA0, BA1 defines the bank to be precharged. If AP is low, autoprecharge is disabled. During a Precharge
command cycle, AP is used in conjunction with BA0, BA1 to control which bank(s) to precharge. If AP is high, all banks
will be precharged regardless of the state of BA0 or BA1. If AP is low, BA0 and BA1 are used to define which bank to pre-
charge.
DQ0~63,
CB0~CB7
In/Out
Data and Check Bit Input/Output pins
DM0~DM8
Input
Masks write data when high, issued concurrently with input data. Both DM and DQ have a write latency of one clock once
the write command is registered into the SDRAM.
V
DD
, V
SS
Supply
Power and ground for the DDR SDRAM input buffers and core logic
DQS0~DQS17
In/Out
Positive line of the differential data strobe for input and output data.
DQS0~DQS17
In/Out
Negative line of the differential data strobe for input and output data.
SA0~SA2
Input
These signals are tied at the system planar to either V
SS
or V
DDSPD
to configure the serial SPD EEPROM address range.
SDA
In/Out
This bidirectional pin is used to transfer data into or out of the SPD EEPROM. A resistor must be connected from the SDA
bus line to V
DDSPD
to act as a pullup.
SCL
Input
This signal is used to clock data into and out of the SPD EEPROM. A resistor may be connected from the SCL bus time
to V
DDSPD
to act as a pullup.
V
DDSPD
Supply
Serial EEPROM positive power supply (wired to a separate power pin at the connector which supports from 1.7 Volt to
3.6 Volt operation).
RESET
Input
The RESET pin is connected to the RST pin on the register and to the OE pin on the PLL. When low, all register outputs
will be driven low and the PLL clocks to the DRAMs and register(s) will be set to low level (The PLL will remain synchro-
nized with the input clock )
Par_In
Input
Parity bit for the Address and Control bus. ( “1 “ : Odd, “0 “ : Even)
Err_Out
Input
Parity error found in the Address and Control bus
TEST
In/Out
Used by memory bus analysis tools (unused on memory DIMMs)
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| M393T6453FG0-CC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC |
| M393T6453FG0-CD5/CC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC |
| M393T6453FG3-CC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC |
| M393T6453FG3-CD5/CC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC |
| M393T6453FZ0-CC | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Registered SDRAM MODULE 240pin Registered Module based on 256Mb F-die 72-bit ECC |
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