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參數(shù)資料
| 型號： | M38039FFSP |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |
| 中文描述： | 單芯片8位CMOS微機 |
| 文件頁數(shù)： | 130/135頁 |
| 文件大小： | 2055K |
| 代理商： | M38039FFSP |
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LQFP64-P-1010-0.50
–
Weight(g)
–
JEDEC Code
EIAJ Package Code
Lead Material
Cu Alloy
64P6Q-A
Plastic 64pin 10
10mm body LQFP
M
D
–
0.1
1.4
–
–
–
0.2
–
–
–
–
–
–
–
–
–
–
–
–
0
°
Symbol
Min
Nom
Max
1.7
A
A
1
A
2
b
c
D
E
e
H
E
L
L
1
Lp
A3
y
b
2
I
2
M
D
M
E
Dimension in Millimeters
H
D
0.225
–
10.4
10.4
1.0
–
–
10
°
0.1
1.0
0.6
0.25
–
0.7
0.5
0.3
12.2
12.0
11.8
12.2
12.0
11.8
0.5
10.1
10.0
9.9
10.1
10.0
9.9
0.175
0.125
0.105
0.28
0.18
0.13
0
e
E
H
E
1
64
49
48
33
32
17
16
H
D
D
M
E
A
F
y
b
2
I
2
Recommended Mount Pad
0.45
–
–
0.75
–
0.08
x
b
x
M
A
1
A
2
L
1
L
Detail F
Lp
A
c
e
MMP
2000 MITSUBISHI ELECTRIC CORP.
New publication, effective Jun. 2000.
Specifications subject to change without notice.
Notes regarding these materials
These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer
’
s application; they do not convey any license under any intellectual property
rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party
’
s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples
contained in these materials.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by
distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision
on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric
Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved
destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to
personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable
material or (iii) prevention against any malfunction or mishap.
HEAD OFFICE: 2-2-3, MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPAN
3803/3804 Group
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
MITSUBISHI MICROCOMPUTERS
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