- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄299433 > M38021E1-256SS (Mitsubishi Electric Corporation) 1 watt dc-dc converters PDF資料下載
參數(shù)資料
| 型號： | M38021E1-256SS |
| 廠商： | Mitsubishi Electric Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | 1 watt dc-dc converters |
| 中文描述： | 1瓦的DC - DC轉換器 |
| 文件頁數(shù)： | 41/62頁 |
| 文件大?。?/td> | 2389K |
| 代理商： | M38021E1-256SS |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁當前第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁
Data Sheet U14893EJ2V0DS
44
PD703032A, 703032AY, 70F3032A, 70F3032AY
5. RECOMMENDED SOLDERING CONDITIONS
The
PD703032A, 703032AY, 70F3032A, and 70F3032AY should be soldered and mounted under the following
recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 5-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
PD703032AGF-×××
×××
×××-3BA: 100-pin plastic QFP (14 ×××× 20)
PD703032AYGF-×××
×××
×××-3BA: 100-pin plastic QFP (14 ×××× 20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds max. (at 210 °C or higher),
Count: Two times or less
Exposure limit: 7 days
Note (after that, prebake at 125 °C for 20 to 72 hours)
IR35-207-2
VPS
Package peak temperature: 215 °C, Time: 25 to 40 seconds (at 200 °C or higher),
Count: Two times or less
Exposure limit: 7 days
Note (after that, prebake at 125 °C for 20 to 72 hours)
VP15-207-2
Wave soldering
Solder bath temperature: 260 °C max., Time: 10 seconds max., Count: Once
Preheating temperature: 120 °C max. (package surface temperature)
Exposure limit: 7 days
Note (after that, prebake at 125 °C for 20 to 72 hours)
WS60-207-1
Partial heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry pack, store it at 25 °C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
相關PDF資料 |
PDF描述 |
|---|---|
| M381L3223ETM-CC5 | 184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
| M381L3223ETM-LC5 | 184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
| M381L6423ETM-CC5 | 184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC |
| M38749MFT-XXXGP | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |
| M38B41E1H-XXXXFP | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| M38022M4472FP | 制造商:Renesas Electronics Corporation 功能描述:M16C FLASH 256K/20K, 24MHZ,DMA,I2C,IEBU - Trays |
| M38022M4-472FP | 制造商:Renesas Electronics Corporation 功能描述:M16C FLASH 256K/20K, 24MHZ,DMA,I2C,IEBU - Trays |
| M38022M4-472FP#U0 | 制造商:Renesas Electronics Corporation 功能描述:M16C FLASH 256K/20K, 24MHZ,DMA,I2C,IEBU - Trays |
| M38027E8FP | 制造商:Renesas Electronics Corporation 功能描述:M16C FLASH 256K/20K, 24MHZ,DMA,I2C,IEBU - Trays |
| M38027E8FP#U0 | 制造商:Renesas Electronics Corporation 功能描述:M16C FLASH 256K/20K, 24MHZ,DMA,I2C,IEBU -LEAD FREE VERSION - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復。