參數(shù)資料
型號(hào): LX5506
廠商: Microsemi Corporation
英文描述: InGaP HBT 4.5 - 6GHz Power Amplifier
中文描述: 的InGaP HBT 4.5 - 6GHz的功率放大器
文件頁(yè)數(shù): 7/10頁(yè)
文件大?。?/td> 509K
代理商: LX5506
LX5506
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7
Copyright
2003
Rev. 1.2c, 2005-08-18
W
M
.
C
InGaP HBT 4.5 – 6GHz Power Amplifier
TM
A P P L I C A T I O N N O T E
Recommended BOM
Location
C1/C2
C3
C4=C6
C5=C8
C7
R1/R2/R3
R4/R5
R6
Value
0.5/0.5pF (0402)
220pF (0402)
1μF (0603)
10μF (0805)
1nF (0402)
100/604/909
(0402)
10/10
(0402)
0
(For Vref=2.9V,
Adjustable for Different Vref)
10mil GETEK
tan
3.9,
ε
r
=
Substrate
0.02
δ
=
Notes:
1) C1/C2 position should be ~30mil from MLP package
edge connected with 50 Ohm microstrip.
2) All other component positions are not critical.
3) R6 should be adjusted to maintain nominal Icq for
different available Vref values (see R6-Vref plot).
4) For Vref<2.9V operation please contact technical
support for BOM modification.
5) C6 can be eliminated when VC/VCC pins are tied
together in multiplayer board layout.
6) C7 ensures ~100ns switching time for PA on/off.
7) For PA switching speed test C8 should be moved to
input side of the switch.
A
P
P
L
I
C
A
T
I
O
N
S
Note: For higher output power
applications VC can be increased up
to 5V with +/-10% tolerance. Contact
Microsemi for details on application
circuit schematic and BOM.
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