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參數(shù)資料
| 型號(hào)： | LX1668CPW-TR |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 1 A SWITCHING CONTROLLER, 250 kHz SWITCHING FREQ-MAX, PDSO20 |
| 封裝： | ROHS COMPLIANT, PLASTIC, TSSOP-20 |
| 文件頁數(shù)： | 8/15頁 |
| 文件大?。?/td> | 392K |
| 代理商： | LX1668CPW-TR |
PROGRAMMABLE MULTIPLE OUTPUT DC:DC CONTROLLER
LX1668
PRODUCT DA T ABOOK 1996/1997
Copyright 1999
Rev. 1.0a
2
P RODUCTION D ATA S HEET
12V Supply Voltage (V
CC12) .................................................................................. 18V
5V Supply Voltage (V
CC5) ....................................................................................... 7V
Supply Voltage (Internal LDO)/(V
CC3) ................................................................... 7V
Output Drive Peak Current Source (500ns) ....................................................... 1.0A
Output Drive Peak Current Sink (500ns) ........................................................... 1.0A
Input Voltage (SS, VID[0:4]) ................................................................... -0.3V to 6V
Operating Junction Temperature .................................................................... 150°C
Storage Temperature Range ........................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
Note 2. V
CC3 supply is used as input to internal low dropout regulator.
Voltages above
3.3V will cause increased thermal dissipation in the package. Power dissipation
should be limited to keep junction temperature below maximum rating.
DW PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
85°C/W
PW PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
110°C/W
Junction Temperature Calculation: T
J = TA + (PD x θJA).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL DATA
ABSOLUTE MAXIMUM RATINGS
(Note 1 & 2)
PACKAGE PIN OUTS
PW PACKAGE — 20-Pin
(Top View)
PGND
BDRV
AGND
SS/ENABLE
V
FB
V
CORE
PWRGD
OVP
VID4
VID3
1
20
219
318
417
516
615
714
813
912
10
11
TDRV
V
CC12
V
CC5
V
OUT2
V
CC3
L
DRV
L
FB
VID0
VID1
VID2
TDRV
V
CC12
V
CC5
V
OUT2
V
CC3
L
DRV
L
FB
VID0
VID1
VID2
PGND
BDRV
AGND
SS/ENABLE
V
FB
V
CORE
PWRGD
OVP
VID4
VID3
DW PACKAGE — 20-Pin
(Top View)
1
20
219
318
417
516
615
714
813
912
10
11
Peak Package Solder Reflow Temp.(40 seconds max. exposure) ............ 260°C (+0, -5)
Pb-free 100% Matte Tin Finish
O
B
SO
LETE
PRO
D
UCT
NOT
RECOMMENDED
FOR
NEW
DESIGNS
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