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參數(shù)資料
| 型號： | LTM9005CV-AB#PBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PBGA204 |
| 封裝： | 22 X 15 MM, 4.32 MM HEIGHT, LEAD FREE, MO-222, LGA-204 |
| 文件頁數(shù)： | 13/24頁 |
| 文件大?。?/td> | 468K |
| 代理商： | LTM9005CV-AB#PBF |
LTM9005
20
9005p
standard practice. It is recommended that all supply
inputs use the same low noise, 3.3V supply, but the ADC
and the amplifiers may be operated from a lower voltage
level if desired. All three rails can operate from the same
3.3V linear regulator but place a ferrite bead between
the supply pins. Separate linear regulators can be used
without additional supply sequencing circuitry if they have
common input supplies.
Grounding and Bypassing
The LTM9005 requires a printed circuit board with a clean
unbrokengroundplane;amultilayerboardwithaninternal
groundplaneisrecommended.ThepinoutoftheLTM9005
has been optimized for a flow-through layout so that the
interactionbetweeninputsanddigitaloutputsisminimized.
The placement of critical pads allows for those signals to
be routed on the top layer.
The ground planes within the LTM9005 are broken in to
three areas: RF ground, IF ground and digital ground.
The mixer (VCC1) and first amplifier (VCC2) return to RF
ground. In Figure ?, this area is to the left of the line start-
ing between pads M6 and M7 and ending between pads
A10 and A11. The RF ground plane is bridged to the IF
ground plane by the SAW filter. All GND pins can connect
to the same ground plane. It is not necessary to break
these ground planes on the circuit board but the pads are
separated and available for use.
The second amplifier (VCC3) and the analog portion of the
ADC (VDD) return to IF ground. All GND pads to the right
of line described above are IF ground. The IF ground plane
is bridged to the digital ground plane by the ADC die. The
digital ground plane uses the OGND pads and extends
under all of the digital output pads.
The LTM9005 is internally bypassed with the mixer (VCC1),
first amplifier (VCC2), second amplifier (VCC3) and ADC
(VDD) supplies returning to ground (GND). The digital
output supply (OVDD) is returned to OGND. Additional
bypass capacitance is optional and may be required if
power supply noise is significant.
Heat Transfer
Most of the heat generated by the LTM9005 is transferred
through the bottom-side ground pads. For good electrical
and thermal performance, it is critical that all ground pins
are connected to a ground plane of sufficient area with as
many vias as possible.
applicaTions inForMaTion
IF GND
DIGITAL GND
9005 F13
A1
RF GND
Figure 13
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