參數(shù)資料
型號: LTCZQ
廠商: Linear Technology Corporation
英文描述: 16-/14-/12-Bit VOUT DACs in 3mm 】 3mm DFN
中文描述: 16/14/12 VOUT電源數(shù)模轉換器采用3mm DFN封裝】3毫米
文件頁數(shù): 18/20頁
文件大小: 317K
代理商: LTCZQ
LTC2641/LTC2642
18
26412f
PACKAGE DESCRIPTION
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
5
2.38
±
0.10
(2 SIDES)
1
4
8
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.5
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
2.38
±
0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.50
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698)
DD Package
10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699)
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