參數(shù)資料
型號(hào): LTC5533EDE
廠商: LINEAR TECHNOLOGY CORP
元件分類: 衰減器
英文描述: 300MHz to 11GHz Precision Dual RF Power Detector
中文描述: 300 MHz - 11000 MHz RF/MICROWAVE LINEAR DETECTOR, 12 dBm INPUT POWER-MAX
封裝: 4 X 3 MM, PLASTIC, MO-229, DFN, DE-12
文件頁(yè)數(shù): 11/12頁(yè)
文件大?。?/td> 253K
代理商: LTC5533EDE
LTC5533
11
5533f
PACKAGE DESCRIPTIO
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DE Package
12-Lead Plastic DFN (4mm
×
3mm)
(Reference LTC DWG # 05-08-1695)
4.00
0.10
(2 SIDES)
3.00
±
0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.70
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
R = 0.20
TYP
0.25
±
0.05
3.30
±
0.10
(2 SIDES)
1
6
12
7
0.50
BSC
PIN 1
NOTCH
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0603
0.25
±
0.05
3.30
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70
±
0.05
(2 SIDES)
2.20
±
0.05
0.50
BSC
0.65
±
0.05
3.50
±
0.05
PACKAGE OUTLINE
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