參數(shù)資料
型號: LTC2240IUP-12#PBF
廠商: Linear Technology
文件頁數(shù): 21/30頁
文件大?。?/td> 0K
描述: IC ADC 12BIT 170MSPS 64-QFN
標準包裝: 40
位數(shù): 12
采樣率(每秒): 170M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 638mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 64-QFN(9x9)
包裝: 管件
輸入數(shù)目和類型: 1 個差分,雙極
LTC2240-12
28
224012fd
9 .00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40
± 0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15
± 0.10
7.15
± 0.10
7.50 REF
(4-SIDES)
0.75
± 0.05
R = 0.10
TYP
R = 0.115
TYP
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
±0.05
7.50 REF
(4 SIDES)
7.15
±0.05
7.15
±0.05
8.10
±0.05 9.50 ±0.05
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
C = 0.35
UP Package
64-Lead Plastic QFN (9mm
× 9mm)
(Reference LTC DWG # 05-08-1705 Rev C)
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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