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參數(shù)資料
| 型號： | LT6301IFE#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDSL LINE DRIVER DUAL 28TSSOP |
| 標準包裝： | 2,000 |
| 類型： | 驅(qū)動器 |
| 驅(qū)動器/接收器數(shù)： | 2/0 |
| 規(guī)程： | xDSL |
| 電源電壓： | 5 V ~ 12 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.173"，4.40mm 寬）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 28-TSSOP 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
15
LT6301
sn6301 6301f
U
PACKAGE DESCRIPTIO
SI PLIFIED SCHE ATIC
WW
(one amplifier shown)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
–IN
V+
Q1
Q5
R1
V –
+IN
OUT
Q2
Q3
Q12
Q4
Q7
Q8
Q6
Q16
Q17
Q15
Q14
Q9
C2
C1
Q13
Q18
6301 SS
Q10
Q11
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EA
FE28 (EA) TSSOP 0203
0.09 – 0.20
(.0036 – .0079)
0
° – 8°
0.45 – 0.75
(.018 – .030)
4.30 – 4.50*
(.169 – .177)
6.40
BSC
13
4
5
6 7 89 10 11 12 13 14
19
20
22 21
15
16
18 17
9.60 – 9.80*
(.378 – .386)
7.56
(.298)
3.05
(.120)
28 2726 25 24 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45
±0.05
0.65 BSC
4.50
±0.10
6.60
±0.10
1.05
±0.10
7.56
(.298)
3.05
(.120)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
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