- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385498 > LQA48B (National Semiconductor Corporation) Cellular Phone Power Management Unit PDF資料下載
參數(shù)資料
| 型號： | LQA48B |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Cellular Phone Power Management Unit |
| 中文描述： | 蜂窩電話電源管理單元 |
| 文件頁數(shù)： | 15/32頁 |
| 文件大?。?/td> | 761K |
| 代理商： | LQA48B |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁當前第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁
I
2
C Compatible Interface Electrical Characteristics
(Continued)
P = (T
J
– T
A
)/
θ
JA
,
(1)
where T
J
is the junction temperature, T
A
is the ambient temperature, and
θ
JA
is the junction-to-ambient thermal resistance.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care
must be paid to thermal dissipation issues in board design.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150
o
C (typ.) and disengages at T
J
= 140
o
C
(typ.).
Note 4:
For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (LLP)
(AN-1187).
Note 5:
The Human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200 pF
capacitor discharged directly into each pin. (EAIJ)
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
(
θ
JA
x P
D-MAX
).
Note 7:
Junction-to-ambient thermal resistance (
θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC
standard JESD51–7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array of thermal vias. The ground plane on the board
is 50 mm x 50 mm. Thickness of copper layers are 36 μm/1.8 μm/18 μm/36 μm (1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22C, still air. Power
dissipation is 1W.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care
must be paid to thermal dissipation issues in board design.
The value of
θ
of this product can vary significantly, depending on PCB material, layout, and environmental conditions. In applications where high maximum power
dissipation exists (high V
, high I
), special care must be paid to thermal dissipation issues. For more information on these topics, please refer to
Application Note
1187: Leadless Leadframe Package (LLP) and the Power Efficiency and Power Dissipation
section of this datasheet.
Note 8:
All limits are guaranteed by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are tested during production
with T
= 25C. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
Note 9:
Capacitors: Low-ESR Surface-Mount Ceramic Capacitors are (MLCCs) used in setting electrical characteristics.
Note 10:
Guaranteed by design.
Note 11:
Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply
in cases it implies operation with an input voltage below the 3.0V minimum appearing under Operating Ratings. For example, this specification does not apply for
devices having 1.5V outputs because the specification would imply operation with an input voltage at or about 1.5V.
Note 12:
LP3941A is not intended as a Li-Ion battery protection device. Battery used in this application should have an adequate internal protection.
L
www.national.com
15
相關PDF資料 |
PDF描述 |
|---|---|
| LQB08A | Single-Ended Input Motor Driver |
| LS248 | BCD TO 7-SEGMENT DECODER |
| LT-5 | Axial Lead and Cartridge Fuses |
| LT1003 | 5V,5A,Voltage Regulator(5V,5A輸出,線性穩(wěn)壓器) |
| LT1004 | Micropower Voltage Reference(微功耗電壓基準) |
相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LQA60A300C | 功能描述:整流器 Q-Series 300V 30A Dual Ultra-Low Qrr RoHS:否 制造商:Vishay Semiconductors 產(chǎn)品:Standard Recovery Rectifiers 配置: 反向電壓:100 V 正向電壓下降: 恢復時間:1.2 us 正向連續(xù)電流:2 A 最大浪涌電流:35 A 反向電流 IR:5 uA 安裝風格:SMD/SMT 封裝 / 箱體:DO-221AC 封裝:Reel |
| LQB08A | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Single-Ended Input Motor Driver |
| LQB10A15NJ00T1M0-501 | 制造商:Murata Manufacturing Co Ltd 功能描述: |
| LQB15MN1N0B02B | 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Inductor (Chip Coil) for High Frequency Film Type LQP15M Series |
| LQB15MN1N0W02B | 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Inductor (Chip Coil) for High Frequency Film Type LQP15M Series |
發(fā)布緊急采購，3分鐘左右您將得到回復。