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1
Infrared Light Emitting Diodes
LN189S
GaAlAs Infrared Light Emitting Diode
1
2
1.0
0.3
0.15
0.6
±
0.1
0.5
±
0.1
0.6
±
0.1
0.4
±
0.1
Mark (Blue)
1.5
±
0.2
3.2
±
0.15
0.1 max.
2.2
±
0.15
6
±
0
5
±
0
3
±
0
3
±
0
0
0
0
0
1
2
±
0
4
±
3
±
0
1
1: Anode
2: Cathode
Unit : mm
Spherical lens
0.4
±
0.03
Light source for distance measuring systems
Absolute Maximum Ratings
(Ta = 25C)
Parameter
Symbol
P
D
I
F
I
FP*
V
R
T
opr
T
stg
Ratings
160
80
0.15
3
–25 to +85
– 40 to +100
Unit
mW
mA
A
V
C
C
Power dissipation
Forward current (DC)
Pulse forward current
Reverse voltage (DC)
Operating ambient temperature
Storage temperature
*
f = 10 kHz, Duty cycle = 25 %
Features
High-power output, high-efficiency : P
O
= 5.5 mW (typ.)
Fast response and high-speed modulation capability :
t
r
, t
f
=20 ns (typ.)
Infrared light emission close to monochromatic light :
λ
P
= 880 nm(typ.)
Narrow direcivity using spherical lenses; works well with optical
systems in auto focus systems
Mini hollow mold resin package
Electro-Optical Characteristics
(Ta = 25C)
Parameter
Symbol
P
O
λ
P
λ
V
F
I
R
t
r
t
f
θ
Conditions
min
3
typ
5.5
880
50
1.60
max
Unit
mW
nm
nm
V
μ
A
ns
ns
deg.
Radiant power
Peak emission wavelength
Spectral half band width
Forward voltage (DC)
Reverse current (DC)
Rise time
Fall time
Half-power angle
I
F
= 100mA
I
F
= 100mA
I
F
= 100mA
I
F
= 100mA
V
R
= 3V
I
FP
= 100mA
I
FP
= 100mA
2.0
10
20
20
15
The angle in which radiant intencity is 50%
Precautions for Use
[Airtightness] This product is not structured to provide a complete air seal. Therefore it cannot be immersed in solutions for
purposes such as boiling tests or ultrasonic cleaning.
[Ability to withstand soldering heat]
The package of this product contains thermoplastic resin which has a limited ability to withstand heat. Therefore
this product cannot be put through automated soldering operations in which the ambient temperature exceeds
the specified temperature. The recommended soldering conditions are as follows.
· Temperature of soldering iron tip : 260C or less
]
or
· Soldering time
: 5 seconds or less
· Soldering position
: At least 2 mm away from lead base
[Ability to withstand chemicals]
If the transparent case requires cleaning, wipe it lightly using ethyl alcohol, methyl alcohol, or isopropyl alcohol.
If you plan to use other solvents, carefully check to make sure there are no problems such as a misshapen case or
a change in the condition of the case material.
: 300C or less
: 1 second or less