- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384605 > LMX9830 (National Semiconductor Corporation) BluetoothTM Serial Port Module PDF資料下載
參數(shù)資料
| 型號： | LMX9830 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | BluetoothTM Serial Port Module |
| 中文描述： | 藍(lán)牙串口模塊 |
| 文件頁數(shù)： | 43/46頁 |
| 文件大小： | 664K |
| 代理商： | LMX9830 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁當(dāng)前第43頁第44頁第45頁第46頁
43
www.national.com
L
15.0 Soldering
The LMX9830 bumps are designed to melt as part of the
Surface Mount Assembly (SMA) process. In order to
ensure reflow of all solder bumps and maximum solder
joint reliability while minimizing damage to the package,
recommended reflow profiles should be used.
Table 40, Table 41 and Figure 27 on page 44 provide the
soldering details required to properly solder the LMX9830 to
standard PCBs. The illustration serves only as a guide and
National is not liable if a selected profile does not work.
See IPC/JEDEC J-STD-020C, July 2004 for more informa-
tion.
Table 40. Soldering Details
Parameter
Value
PCB Land Pad Diameter
13 mil
PCB Solder Mask Opening
19 mil
PCB Finish (HASL details)
Defined by customer or manufacturing facility
Stencil Aperture
17 mil
Stencil Thickness
5 mil
Solder Paste Used
Defined by customer or manufacturing facility
Flux Cleaning Process
Defined by customer or manufacturing facility
Reflow Profiles
See Figure 27 on page 44
Table 41. Classification Reflow Profiles
1,2
Profile Feature
NOPB Assembly
Average Ramp-Up Rate (Ts
MAX
to Tp)
3°C/second maximum
Preheat
:
Temperature Min (Ts
MIN
)
Temperature Max (Ts
MAX
)
Time (ts
MIN
to ts
MAX
)
150°C
200°C
60–180 seconds
Time maintained above:
Temperature (T
L
)
Time (t
L
)
217°C
60–150 seconds
Peak/Classification Temperature (Tp)
260 + 0°C
Time within 5°C of actual Peak Temperature (tp)
20–40 seconds
Ramp-Down Rate
6°C/second maximum
Time 25 °C to Peak Temperature
8 minutes maximum
Reflow Profiles
See Figure 27
1.
2.
See IPC/JEDEC J-STD-020C, July 2004.
All temperatures refer to the top side of the package, measured on the package body surface.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LMX9830SM | BluetoothTM Serial Port Module |
| LMX9830SMX | BluetoothTM Serial Port Module |
| LMX9838 | Bluetooth Serial Port Module |
| LMX9838SB | Bluetooth Serial Port Module |
| LMX9838SBX | Bluetooth Serial Port Module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LMX9830DONGLE | 功能描述:藍(lán)牙/802.15.1 開發(fā)工具 LMX9830 BLUETOOTH EVAL KIT RoHS:否 制造商:Panasonic Electronic Components 產(chǎn)品:Bluetooth Evaluation Kit 工具用于評估:PAN1721 頻率:2.4 GHz 接口類型:I2C 工作電源電壓:2 V to 3.6 V |
| LMX9830DONGLE/NOPB | 制造商:Texas Instruments 功能描述:Evaluation Kit For Bluetooth Serial Port Module |
| LMX9830SM | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:BluetoothTM Serial Port Module |
| LMX9830SM/NOPB | 功能描述:射頻收發(fā)器 RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| LMX9830SMX | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:BluetoothTM Serial Port Module |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。