參數(shù)資料
型號： LMK04010BISQE/NOPB
廠商： National Semiconductor
文件頁數(shù)： 42/65頁
文件大?。?/td> 0K
描述： IC CLOCK COND 1.2GHZ W/PLL 48LLP
標準包裝： 1
系列： PowerWise®
類型： 時鐘調(diào)節(jié)器
PLL： 是
輸入： LVCMOS
輸出： 2VPECL，LVPECL
電路數(shù)： 1
比率 - 輸入:輸出： 2:5
差分 - 輸入:輸出： 是/是
頻率 - 最大： 1.296GHz
除法器/乘法器： 是/是
電源電壓： 3.15 V ~ 3.45 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 48-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 48-LLP（7x7）
包裝： 標準包裝
產(chǎn)品目錄頁面： 1275 (CN2011-ZH PDF)
其它名稱： LMK04010BISQEDKR
0.33 mm, typ
1.2 mm, typ
5.0 mm, min
SNOSAZ8J – SEPTEMBER 2008 – REVISED SEPTEMBER 2011
Power Supply Conditioning
The recommended technique for power supply management is to connect the power pins for the clock outputs
(pins 13, 37, 40, 43, and 46) to a dedicated power plane and connect all other power pins on the device (pins 3,
8, 18, 19, 22, 24, 30, 31, and 33) to a second power plane. Note: the LMK04000 family has internal voltage
regulators for the PLL and VCO blocks to provide noise immunity.
Thermal Management
Power consumption of the LMK04000 family of devices can be high enough to require attention to thermal
management. For reliability and performance reasons the die temperature should be limited to a maximum of
125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not
exceed 125 °C.
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land
pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A
recommended land and via pattern is shown in Figure 15. More information on soldering WQFN packages can
Figure 15. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite
side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but
should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in
Figure 15 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
dissipated.
Copyright 2008–2011, Texas Instruments Incorporated
47
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參數(shù)描述
LMK04010BISQX 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Low-Noise Clock Jitter Cleaner with Cascaded PLLs
LMK04010BISQX/NOPB 功能描述:時鐘合成器/抖動清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
LMK04011BISQ 制造商:Texas Instruments 功能描述:Clock Conditioner 48-Pin LLP EP T/R
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LMK04011BISQE 制造商:Texas Instruments 功能描述:Clock Conditioner 48-Pin LLP EP T/R 制造商:Texas Instruments 功能描述:PRECISION CLOCK CONDITIONER, 48LLP
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