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參數(shù)資料
| 型號： | LMD18400 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Quad High Side Driver |
| 中文描述： | 四高邊驅(qū)動器 |
| 文件頁數(shù)： | 12/18頁 |
| 文件大小： | 329K |
| 代理商： | LMD18400 |
Applications Information
(Continued)
Figure 11 indicates the range of load resistance for normal
operation, open load, and shorted load or power limit indica-
tion.
TL/H/11026–20
FIGURE 11. Load Resistance Detected as Errors
THERMAL MANAGEMENT
It is particularly important to consider the total amount of
power being dissipated by all four switches in the
LMD18400 at all times. Any combination of the switches
driving loads will cause an increase in the die temperature.
Should the die temperature reach the thermal shutdown
threshold of
a
170
§
C, all of the switches will be disabled.
Careful calculation of the worst case total power dissipation
required at any point in time, together with providing suffi-
cient heatsinking will prevent this from occurring.
The LMD18400 is packaged with a special leadframe that
helps dissipate heat through the two ground pins on each
side of the package. The thermal resistance from junction-
to-case (
i
JC
) for this package is approximately 20
§
C/W.
The thermal resistance from junction-to-ambient (
i
JA
), with-
out any heatsinking, is approximately 60
§
C/W. Figure 12 il-
lustrates how the copper foil of a printed circuit board can
be designed to provide heatsinking and reduce the overall
junction-to-ambient thermal resistance.
The power dissipation in each switch is equal to:
P
D (Each Switch)
e
I
Load2
c
R
ON
or
(V
CC
b
V
OUT
)
2
R
ON
where R
ON
is the ON resistance of the switch (1.3
X
maxi-
mum). These equations hold true until the power dissipation
reaches the maximum limit of 15W. With resistive loads, the
15W power limit threshold will be reached when:
R
L
s
V
CC2
60W
Inductive loads will create additional power dissipation when
switched OFF. Figure 13 shows the idealized voltage and
current waveforms for an inductive load.
TL/H/11026–21
Maximum Power Dissipated
and Junction to Ambient
Thermal Resistance vs Size
TL/H/11026–22
FIGURE 12. Recommended PC Board Layout to Reduce the Thermal Resistance from Junction-to-Ambient
http://www.national.com
12
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