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參數(shù)資料
| 型號(hào)： | LM98555 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | CCD Driver |
| 中文描述： | CCD驅(qū)動(dòng)器 |
| 文件頁(yè)數(shù)： | 7/9頁(yè) |
| 文件大?。?/td> | 691K |
| 代理商： | LM98555 |
Application Information
The LM98555 is a fully integrated clock driver/buffer for high
speed CCD applications. It provides high performance low
impedance drivers, with optimized low skew performance of
the P1 and P2 outputs. Enable inputs allow use of two, four,
six, or all eight P1 and P2 drivers to optimize the amount of
drive for the application. The 64 pin thermally enhanced
TSSOP provides excellent power handling through the use
of an exposed heat transfer pad on the underside of the
package.
THERMAL GUIDELINES
The LM98555’s maximum power dissipation limit, shown in
the Operating Conditions section, must be strictly adhered
to. The product’s multiple high-strength drivers, with their
ability to drive a wide-range of loads, make it possible to be
within spec on each output and yet violate the aggregate
maximum power dissipation limit for the total product. Spe-
cial caution must be paid to this by limiting the chip’s oper-
ating conditions (loads, power supply, number of parallel
drivers enabled, frequency of operation) to make certain that
the maximum power dissipation limit is never exceeded.
Thermal characterization of the device has been done to
provide reference points under specific conditions.
θ
junction
to ambient was measured using a 5.5 inch by 3 inch, 4 layer
PCB. The thermal contact pad on the board was connected
using vias to a full ground plane on one of the internal layers.
The recommended thermal pad is shown in
Figure 4
.
The vias shown provide a path for heat to flow from the pad
to a heat sinking or dissipating area of the printed circuit
board. The following figures show several typical examples
of how this can be done, and illustrate how heat is conducted
away from the IC to larger areas where it is dissipated.
In multi-layer board applications, one or more internal planes
are usually dedicated as a ground plane. Connecting the
thermal pad to this ground plane with vias will usually pro-
vide adequate heat management. In 2 layer boards, it is
20126406
FIGURE 4. Exposed Pad Land Pattern
20126407
FIGURE 5. 4 Layer PCB - Example 1
20126409
FIGURE 6. 4 Layer PCB - Example 2
20126408
FIGURE 7. 2 Layer PCB
L
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM98555CCMH | 功能描述:顯示驅(qū)動(dòng)器和控制器 RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel |
| LM98555CCMH/NOPB | 功能描述:顯示驅(qū)動(dòng)器和控制器 RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel |
| LM98555CCMHX | 功能描述:顯示驅(qū)動(dòng)器和控制器 RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel |
| LM98555CCMHX/NOPB | 功能描述:顯示驅(qū)動(dòng)器和控制器 RoHS:否 制造商:Panasonic Electronic Components 工作電源電壓:2.7 V to 5.5 V 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Reel |
| LM98620 | 制造商:IRF 制造商全稱:International Rectifier 功能描述:10-bit 70 MSPS 6 Channel Imaging Signal Processor with 10-bit 70 MSPS 6 Channel Imaging Signal Processor with |
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