參數(shù)資料
型號: LM98555
廠商: National Semiconductor Corporation
英文描述: CCD Driver
中文描述: CCD驅(qū)動器
文件頁數(shù): 6/9頁
文件大?。?/td> 691K
代理商: LM98555
AC Electrical Characteristics
(Continued)
Note 1:
Absolute maximum ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits.
Note 2:
Package power rating assumes the exposed thermal pad is soldered to the printed circuit board as recommended, with significant heat spreading provided
by vias to internal or bottom heat dissipation planes or pad. If this is not the case, then the package power rating should be reduced. See the Thermal Guidelines
in the applications section for more information.
Note 3:
This is the power dissipated on-chip due to all currents flowing through the device - both DC and AC. This operating condition will be violated if all driver
outputs are fully loaded and operating at the same time at the rated F
MAX
. The system design must constrain the chip’s operating conditions (loads, power supply,
number of parallel drivers enabled, frequency of operation) to make certain that this limit is never exceeded.
Note 4:
Package thermal resistance for junction to ambient is based on a 5.5 inch by 3 inch, 4 layer printed circuit board, with thermal vias connecting the heat
sinking pad to a full internal ground plane. Tests were done in still air, with a power dissipation of 2.0 W, at an ambient temperature of 22C.
Note 5:
Propagation Delay High-to-Low with output low trigger voltage at V
DDO
*0.75.
Note 6:
Propagation Delay Low-to-High with output high trigger voltage at V
DDO
*0.25.
Note 7:
Typical values determined from characterization testing only. Not production tested or guaranteed.
Test Conditions
20126403
FIGURE 3. AC Test Conditions
L
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