參數(shù)資料
型號： LFM34INTPU1A
廠商： Freescale Semiconductor
文件頁數(shù)： 56/60頁
文件大?。?/td> 0K
描述： ADAPTER MPC5534 324-BGA
標(biāo)準(zhǔn)包裝： 1
模塊/板類型： 適配器板
MPC5534 Microcontroller Data Sheet, Rev. 6
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
6 The thermal characterization parameter indicates the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
相關(guān)PDF資料
PDF描述
EEM28DTKT-S288 CONN EDGECARD 56POS .156 EXTEND
ADM6318CY46ARJZ-R7 IC SUPERVISOR W/RESET SOT23-5
PCG0J471MCL1GS CAP ALUM 470UF 6.3V 20% SMD
MAX6442KAOSTD3+T IC BATTERY MON DUAL SOT23-8
VI-BW3-EY-F2 CONVERTER MOD DC/DC 24V 50W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFM-39A 制造商:Leader 功能描述:
LFM53INTPU1A 功能描述:IC 與器件插座 MPC5553 324-PIN BGA TO P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
LFM53INTPWA 功能描述:IC 與器件插座 MPC5553 416-PIN BGA TO P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
LFM54INTPWA 功能描述:插座和適配器 PB-FREE MPC5554 BGA TO P RoHS:否 制造商:Silicon Labs 產(chǎn)品:Adapter 用于:EM35x
LFM65INTPU1A 功能描述:插座和適配器 PBSN MPC5565 324 BGA TO RoHS:否 制造商:Silicon Labs 產(chǎn)品:Adapter 用于:EM35x
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*