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| 型號： | LFM34INTPU1A |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 49/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | ADAPTER MPC5534 324-BGA |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 模塊/板類型： | 適配器板 |
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Revision History for the MPC5534 Data Sheet
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
53
5.3
Changes Between Revisions 3.0 and 4.0
The following table lists the substantive text changes made to paragraphs.
Last paragraph: Changed the first sentence FROM . . . the voltage on the pins goes to high-impedance until . . .
TO. . .the pins go to a high-impedance state until . . .
Table 29. Text Changes Between Rev. 3.0 and 4.0
Location
Description of Changes
Title Page:
Changed the Revision number from 3.0 to 4.0. Changed the date format to DD MMM YYYY. Made the same
changes in the lower left corner of the back page.
Added the sentence directly preceding Table 1: ‘Unless noted in this data sheet, all specifications apply
from TL to TH.’
Sections 3.7.1, 3.7.2 and 3.7.3: Reordered sections resulting in the following order and section renumbering:
Added the following text directly before this section and after Table 8 Pin Status for Medium and Slow Pads During
the Power-on Sequence:
‘The values in Table 7 and Table 8 do not include the effect of the weak pull devices on the output pins during
power up.
Before exiting the internal POR state, the voltage on the pins goes to high-impedance until POR negates. When
the internal POR negates, the functional state of the signal during reset applies and the weak pull devices (up
or down) are enabled as defined in the device Reference Manual. If VDD is too low to correctly propagate the
logic signals, the weak-pull devices can pull the signals to VDDE and VDDEH.
To avoid this condition, minimize the ramp time of the VDD supply to a time period less than the time required to
enable the external circuitry connected to the device outputs.’
Section 3.7.3, “Power-Down Sequence (VRC33 Grounded)” Deleted the underscore in ORed_POR to become ORed POR.
Table 28. Text Changes Between Rev. 4.0 and 5.0 (continued)
Location
Description of Changes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| LFM-39A | 制造商:Leader 功能描述: |
| LFM53INTPU1A | 功能描述:IC 與器件插座 MPC5553 324-PIN BGA TO P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| LFM53INTPWA | 功能描述:IC 與器件插座 MPC5553 416-PIN BGA TO P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| LFM54INTPWA | 功能描述:插座和適配器 PB-FREE MPC5554 BGA TO P RoHS:否 制造商:Silicon Labs 產(chǎn)品:Adapter 用于:EM35x |
| LFM65INTPU1A | 功能描述:插座和適配器 PBSN MPC5565 324 BGA TO RoHS:否 制造商:Silicon Labs 產(chǎn)品:Adapter 用于:EM35x |
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