× 70mm × 1.6mm
參數(shù)資料
型號: LA4425PV-TLM-H
廠商: ON Semiconductor
文件頁數(shù): 3/8頁
文件大?。?/td> 0K
描述: IC AUDIO POWER AMP 5W 44SSOP
標準包裝: 2,000
類型: AB 類
輸出類型: 1-通道(單聲道)
在某負載時最大輸出功率 x 通道數(shù)量: 6W x 1 @ 4 歐姆
電源電壓: 5 V ~ 16 V
特點: 消除爆音,過壓保護,短路保護,熱保護
安裝類型: *
供應(yīng)商設(shè)備封裝: *
封裝/外殼: *
包裝: *
LA4425PV
No.A2011-3/8
Board specifications of the Pdmax - Ta measurement
(LA4425PV specified PCB)
Size: 70mm
× 70mm × 1.6mm3 (Four layer boards)
Copper foil thickness: L1/L4=18m, L2/L3=35m
Materials: FR-4 (Glass cloth matrix epoxy resin)
L1: Figure of copper wiring pattern
L2: Figure of copper wiring pattern
L3: Figure of copper wiring pattern
L4: Figure of copper wiring pattern
Notes:
The data for the case with the exposed die-pad substrate mounted shows the values when 95% or more of the Exposed
Die-Pad is wet.
1.
For the set design, employ the derating design with sufficient margin.
2.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such
as vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below:
(1) Maximum value 80% or less for the voltage ratings
(2) Maximum value 80% or less for the current ratings
(3) Maximum value 80% or less for the temperature ratings
3.
After the set has been designed, be sure to verify the design with the actual product. Confirm the solder joint state
and verify also the reliability of solder joint for the Exposed Die-Pad, etc. Any void or deterioration, if observed in
the solder joint of these parts, causes deteriorated thermal conduction, possibly resulting in thermal destruction of
IC.
-40
-20
0
20
40
60
80
100
0
6.0
1.0
2.0
3.0
4.0
5.0
Pd max -- Ta
5.15
2.68
Ambient temperature, Ta -- C
Maximum
power
dissipation,
Pd
max
-
W
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