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參數(shù)資料
| 型號(hào)： | L9935 |
| 廠商： | 意法半導(dǎo)體 |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | TWO-PHASE STEPPER MOTOR DRIVER |
| 中文描述： | 兩相步進(jìn)電機(jī)驅(qū)動(dòng)器 |
| 文件頁數(shù)： | 3/19頁 |
| 文件大?。?/td> | 159K |
| 代理商： | L9935 |
ELECTRICAL CHARACTERISTICS
(8V
≤
V
S
≤
24V;-40
°
C
≤
T
j
≤
150
°
C;4.5V
≤
V
CC
≤
5.5V, unless oth-
erwise specified.)
1)
Symbol
SUPPLY
IS
85
Parameter
Test Condition
Min.
Typ.
Max.
Unit
Total Supply Current
I
S
+ I
VCC
(Both Bridges Off)
V
S
= 14V
EN = HIGH
T
J
≤
85
°
C
I
OUT Ai/Bi
= 0
f
OSC
= 30kHz
V
S
= 14V
EN = LOW
40
100
μ
A
I
SOP
Operating Supply Current
4.5
mA
I
CC
5V Supply Current
1.4
10
mA
FULL BRIDGES
R
OUT, Sink
R
OUT, Source
R
DSON
of Sink Transistors
RDSON of Source Transistors
Current bit
combinations LL, LH,
V
S
≥
12V
0.4
0.4
0.7
0.7
R
OUT8, Sink
RDSON of Sink Transistors +
R
DSON
of Source Transistors
Current bit
Combinations LL, LH,
V
S
= 8V
EN = HIGH
I
FWD
= 1A; V
S
≥
12V
EN = LOW
I
REV
= 1A
0.1...0.9 V
OUT
V
S
= 14V
Chopping 550mA
1.6
3
V
FWD
Forward Voltage of the DMOS
Body Diodes
Reverse DMOS Voltage
1
1.4
V
V
REV
0.5
0.9
V
t
r
, t
f
Rise and Fall Time of Outputs
OUT
Ai/Bi
0.3
0.6
1.5
μ
s
ABSOLUTE MAXIMUM RATINGS
Symbol
V
S
V
SPulsed
V
OUT (Ai/Bi)
Parameter
Value
-0.3 to 35
-0.3 to 40
Unit
V
V
DC Supply Voltage
Pulsed supply voltage T < 400ms
Output Voltages
internally clamped to V
S
or GND depending on the
current direction
±
1.2
±
2.5
-0.3 to 6.2
-0.3 to 6.2
-0.3 to 10
-2 to 8
I
OUT (Ai/Bi)
DC Output Currents
Peak Output Currents (T/tp
≥
10)
Sense Resistor Voltages
Logic Supply Voltages
Charge Pump BufferVoltage versus V
S
Logic Input Voltages
A
A
V
V
V
V
V
SRA/SRB
V
CC
V
CDRV
V
SCK
, V
SDI
,
V
CSN
, V
EN
V
OSC
, V
SDO
Oscillator Voltage Range, Logic Output
-0.3 to V
CC
+0.3
V
Note: ESD for all pins, except pins SDO, SRA and SRB, are according to MIL883C, tested at 2kV, corresponding to a maximum energy
dissipation of 0.2mJ. SDO, SRA and SRB pins are tested with 800V.
THERMAL DATA
Symbol
R
th j-case
R
th j-amb
Parameter
Value
5
35
Unit
°
C/W
°
C/W
Typical Thermal Resistance Junction to Case
Typical Thermal Resistance Junction to Ambient
(6cm
2
Ground Plane 35
μ
m Thhickness)
Typical Thermal Resistance Junction to Ambient
(soldered on a FR 4 board with through holes for heat transfer
and external heat sink applied)
Storage Temperature
Typical Thermal Shut-Down Temperature
R
thj-amb, FR4
8
°
C/W
T
S
T
SD
-40 to 150
180
°
C
°
C
L9935
3/19
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