L6917
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DeviceDescription
The device is an integrated circuitrealized in BCD technology. It provides complete control logic and protections
for a high performance multiphase step-down DC-DC converter optimized for microprocessor power supply. It
is designed to drive N Channel MOSFETs in a dual-phase synchronous-rectified buck topology. A 180 deg
phase shift is provided between the two phases allowing reduction in the input capacitor current ripple, reducing
also the size and the losses. The output voltage of the converter can be precisely regulated, programming the
VID pins, from 1.100V to 1.850V with 25mV binary steps, with a maximum tolerance of
±
0.8% over temperature
and line voltage variations. The device provides an average current-mode control with fast transient response.
It includes a 300kHz free-running oscillatorexternally adjustable up to 1MHz. The error amplifier features a 15V/
μ
s
slew rate that permits high converter bandwidth for fast transient performances. Current information is read
across the lower mosfets rDSON or across a sense resistor in fully differential mode. The current information
corrects the PWM output in order to equalize the average current carried by each phase. Current sharing be-
tween the two phases is then limited at
±
10% over static and dynamic conditions. The device protects against
over-current, with an OC threshold for each phase, entering in HICCUP mode. After three hiccup cycles, the
condition islatched and the FAULT pin isdriven high. The device performs also an under voltage protection that
causes a hiccup cycle when detected, and anover voltage protection that disable immediately the device turning
ON the lower driver and driving high the FAULT pin.
The device is available in SO28 package.
Oscillator
The switching frequency is internally fixed to 300kHz. The internal oscillator generates the triangular waveform
for the PWM charging and discharging with a constant current an internal capacitor. The current delivered to the
oscillator is typically 25
μ
A (F
SW
= 300KHz) and may be varied using an external resistor (R
OSC
) connected be-
tween OSC pin and GND or Vcc. Since the OSC pin is maintained at fixed voltage (typ). 1.235V, the frequency
is varied proportionally to the currentsunk(forced) from (into) the pin considering the internal gain of 12KHz/
μ
A.
In particular connecting it to GND the frequency is increased (current is sunk from the pin), while connecting
ROSC to Vcc=12V the frequency is reduced (current is forced into the pin), according to the following relation-
ships:
Note that forcing a 25
μ
A current into this pin, the device stops switching because no current is delivered to the
oscillator.
Figure 1. R
OSC
vs. Switching Frequency
R
OSC
vs. GND: f
S
300kHz
1.237
R
OSC
K
(
)
------------------------------
12kHz
A
-----------
+
300kHz
14.82 10
6
R
OSC
K
(
)
------------------------------
+
=
=
R
OSC
vs. 12V: f
S
300kHz
12
R
OSC
K
(
)
--------–
12kHz
A
-----------
+
300kHz
7
R
OSC
K
(
)
--------------------------------
–
=
=
0
1000
2000
3000
4000
5000
6000
7000
0
100
200
300
Frequency(KHz)
R
)
0
100
200
300
400
500
600
700
800
900
1000
300
400
500
Frequency(KHz)
600
700
800
900
1000
R
)