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參數(shù)資料
| 型號： | L6372 |
| 英文描述： | OCTAL INDUSTRIAL INPUT INTERFACE(253.91 k) |
| 中文描述： | 八路工業(yè)輸入接口（253.91十一） |
| 文件頁數(shù)： | 5/15頁 |
| 文件大?。?/td> | 253K |
| 代理商： | L6372 |
THERMAL CHARACTERISTICS
R
th j-pin
POWERDIP
. The thermal resistance is re-
ferred to the thermal path from the dissi-
pating region on the top surface of the sili-
con chip, to the points along the four
central pins of the package, at a distance
of 1.5 mm awayfrom the stand-offs.
SO
. Similarly, the reference point is the
knee on the four central pins, where the
pins are upwardly bent and the soldering
jointwith the PCB footprintcan bemade.
R
th j-amb 1
If a dissipating surface, thick at least 35
μ
m
and with a surface similar or bigger than
the one shown, is created making use of
the printed circuit. Such heatsinking sur-
face is considered on the bottom side of an
horizontalPCB (worst case).
Figure1:
Printed Heatsink
R
th j-amb 2
If the power dissipating pins (the four cen-
tral ones), as well as the others, have a
minimum thermal connection with the ex-
ternal world (very thin strips only) so that
the dissipation takes place through still air
and throughthe PCBitself.
It is the same situation of point above,
without any heatsinkingsurface created on
purposeon the board.
Additional data for the PowerDip package can be
foundin:
ApplicationNote 9030:
Thermal Characteristicsof the Power Dip
20, 24 PackagesSoldered on 1,2,3 oz.
CopperPCB
THERMAL DATA
Symbol
R
th j-pin
R
th j-amb1
Parameter
DIP 20
12
40
SO 20
17
65
Unit
°
C/W
°
C/W
Thermal Resistance Junction to Pin
Thermal Resistance Junction to Ambient
(see Thermal Characteristics)
Thermal Resistance Junction to Ambient
(see Thermal Characteristics)
R
th j-amb2
50
80
°
C/W
L6372
5/15
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