參數(shù)資料
型號(hào)： L558
廠商： IXYS Corporation
英文描述： IGBT Module
中文描述： IGBT模塊
文件頁數(shù)： 2/5頁
文件大?。?/td> 207K
代理商： L558
2 - 5
2003 IXYS All rights reserved
IXYS reserves the right to change limits, test conditions and dimensions.
3
VWI 20-06P1
Dimensions in mm (1 mm = 0.0394")
Diodes
Symbol
Conditions
Maximum Ratings
I
F25
I
F80
T
C
= 25°C
T
C
= 80°C
21
14
A
A
Symbol
Conditions
Characteristic Values
min.
typ.
max.
V
F
I
F
= 10 A; T
VJ
= 25°C
T
VJ
= 125°C
1.9
1.4
2.1
V
V
I
RM
t
rr
I
F
= 10 A; di
/dt = -400 A/μs; T
VJ
= 125°C
V
R
= 300 V; V
GE
= 0 V
11
80
A
ns
R
thJC
R
thJH
Data according to IEC 60747 and refer to a single diode unless otherwise stated.
3.5 K/W
K/W
with heatsink compound (0.42 K/m.K; 50 μm)
7.0
Component
Symbol
Conditions
Maximum Ratings
T
VJ
T
stg
-40...+150
-40...+125
°
C
°
C
V
ISOL
I
ISOL
≤
1 mA; 50/60 Hz; t = 1 s
3600
V~
M
d
mounting torque (M4)
1.5 - 2.0
14 - 18
Nm
lb.in.
m/s
2
a
Max. allowable acceleration
50
Symbol
Conditions
Characteristic Values
min. typ.
max.
d
S
d
A
Creepage distance on surface
(Pin to heatsink)
Strike distance in air
(Pin to heatsink)
11.2
11.2
mm
mm
Weight
24
g
Temperature Sensor NTC
Symbol
Conditions
Characteristic Values
min.
typ.
max.
R
25
B
25/50
T = 25°C
4.75
5.0
5.25 k
3375
K
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