
SERIAL PRESENCE DETECT
SDRAM MODULE
Byte #
Function Described
Function Supported
Hex value
Note
-0
-0
64
Manufacturer JEDEC ID code
Samsung
CEh
65~71
...... Manufacturer JEDEC ID code
Samsung
00h
72
Manufacturing location
Onyang Korea
01h
73
Manufacturer part # (Samsung memory)
K
4Bh
74
Manufacturer part # (Samsung memory)
M
4Dh
75
Manufacturer part # (Memory module)
M
4Dh
76
Manufacturer part # (Memory type & edge connector)
4
34h
77
Manufacturer part # (Data bits)
Blank
20h
78
...... Manufacturer part # (Data bits)
6
36h
79
...... Manufacturer part # (Data bits)
6
36h
80
Manufacturer part # (Mode & operating voltage)
S
53h
81
Manufacturer part # (Module density)
1
31h
82
...... Manufacturer part # (Module density)
7
37h
83
Manufacturer part # (Refresh, # of banks in Comp. & interface)
2
32h
84
Manufacturer part # (Compositon component)
4
34h
85
Manufacturer part # (Component revision)
Blank
20h
86
Manufacturer part # (Package type)
T
54h
87
Manufacturer part # (PCB revision)
2
32h
88
Manufacturer part # (Hyphen)
" - "
2Dh
89
Manufacturer part # (Power)
F
46h
90
Manufacturer part # (Minimum cycle time)
0
30h
91
Manufacturer revision code (For PCB)
2
32h
92
...... Manufacturer revision code (For component)
M-die (1st Gen.)
20h
93
Manufacturing date (Week)
-
-
3
94
Manufacturing date (Year)
-
-
3
95~98
Assembly serial #
-
-
4
99~12
Manufacturer specific data (may be used in future)
-
FFh
126
System frequency for 66MHz
66MHz
66h
127
CAS latency for 66MHz
CAS latency of both 2 & 3
06h
128+
Unused storage locations
-
FFh
1. The bank select address is excluded in counting the total # of addresses.
2. This value is based on the component specification.
3. These bytes are programmed by code of Date Week & Date Year.
4. These bytes are programmed by Samsung
′
s own Assembly Serial # system. All modules may have different unique serial #.
Note :