參數(shù)資料
型號: K4F660812D
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 8M x 8bit CMOS Dynamic RAM with Fast Page Mode
中文描述: 8米× 8位的CMOS動態(tài)隨機存儲器的快速頁面模式
文件頁數(shù): 6/20頁
文件大?。?/td> 368K
代理商: K4F660812D
CMOS DRAM
K4F660812D,K4F640812D
AC CHARACTERISTICS
(Continued)
Parameter
Symbol
-45
-50
-60
Units
Note
Min
Max
Min
Max
Min
Max
Refresh period (Normal)
t
REF
t
REF
t
WCS
t
CWD
t
RWD
t
AWD
t
CPWD
t
CSR
t
CHR
t
RPC
t
CPA
t
PC
t
PRWC
t
CP
t
RASP
t
RHCP
t
OEA
t
OED
t
OEZ
t
OEH
t
WTS
t
WTH
t
WRP
t
WRH
t
RASS
t
RPS
t
CHS
64
64
64
ms
Refresh period (L-ver)
128
128
128
ms
Write command set-up time
0
0
0
ns
7
CAS to W delay time
32
36
38
ns
7
RAS to W delay time
67
73
83
ns
7
Column address to W delay time
43
48
53
ns
7
CAS precharge W delay time
48
53
60
ns
CAS set-up time (CAS -before-RAS refresh)
5
5
5
ns
CAS hold time (CAS -before-RAS refresh)
10
10
10
ns
RAS to CAS precharge time
5
5
5
ns
Access time from CAS precharge
26
30
35
ns
3
Fast Page mode cycle time
31
35
40
ns
Fast Page mode read-modify-write cycle time
70
76
85
ns
CAS precharge time (Fast page cycle)
9
10
10
ns
RAS pulse width (Fast page cycle)
45
200K
50
200K
60
200K
ns
RAS hold time from CAS precharge
28
30
35
ns
OE access time
12
13
15
ns
3
OE to data delay
12
13
13
ns
Output buffer turn off delay time from OE
0
13
0
13
0
13
ns
6
OE command hold time
12
13
15
ns
Write command set-up time (Test mode in)
10
10
10
ns
11
Write command hold time (Test mode in)
15
15
15
ns
11
W to RAS precharge time (C-B-R refresh)
10
10
10
ns
W to RAS hold time (C-B-R refresh)
10
10
10
ns
RAS pulse width (C-B-R self refresh)
100
100
100
us
13,14,15
RAS precharge time (C-B-R self refresh)
80
90
110
ns
13,14,15
CAS hold time (C-B-R self refresh)
-50
-50
-50
ns
13,14,15
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K4F641612C-TL50 4M x 16bit CMOS Dynamic RAM with Fast Page Mode
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