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參數(shù)資料
| 型號(hào)： | IT1A-168S-SV |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
| 中文描述： | 高速，匹配阻抗，平行板對(duì)板連接器系統(tǒng) |
| 文件頁數(shù)： | 1/17頁 |
| 文件大?。?/td> | 1081K |
| 代理商： | IT1A-168S-SV |
1
High Speed, Matched-Impedance, Parallel Board-to-board Connector System
IT1 Series
NEW
2004.8
I
Features
1. Impedance Matching using a 4-Layer Board
The innovative transmission module uses PC boards
with a strip line design of transmission lines, providing
matched impedance of 50 ohms, for standard product.
2. Supports Multiple Connectors per board
Designed with a tolerance of +/- 0.2mm for both the X
and Y-axis. The three-piece structure and the +/- 0.2mm
tolerance allows 3 or more IT1’s to be mounted on a
single board.
3. Customized Board-to-Board Distance
Board-to-board distance can be customized, from 16mm
to 40mm.
Ground lines or additional traces can be added to
support high level, high speed transmission or mixed
power/signal applications.
4. Signal to Ground Ratio
The standard signal-to-ground ratio is 10:2, which makes
reliable matching of the characteristic impedance of each
transmission line. This ratio also can be customized.
5. Contact Reliability
Use of double contact points on each of the contacts
assures highly reliable performance.
I
Applications
Routers, servers, base stations and other
telecommunication equipment.
IT1 Series Outline
High-speed matched-impedance parallel board-to-board
connector designed for applications requiring board-to-
board spacing with transmission speeds exceeding
1GHz. The connection system has matched impedance
of 50 ohm or can be customized. Contacts are on 0.5mm
pitch.
4-Layer board
(Impedance matching)
2-Point contact
2-Point contact
(
(
Receptacle
Transmission Module
Receptacle
G
Connection Cross-Sectional Diagram
Receptacle (2 required)
Transmission Module
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IT1-252S-SV | High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
| IT1A-252S-SV | High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
| IT1-168S-SV | High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
| ITA10B1 | Bidirectional TRANSIL Array for Dataline Protection(用于數(shù)據(jù)線保護(hù)的雙向TRANSIL陣列) |
| ITA18B1 | Bidirectional TRANSIL Array for Dataline Protection(用于數(shù)據(jù)線保護(hù)的雙向TRANSIL陣列) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IT1A-168S-SV(25) | 功能描述:板對(duì)板與夾層連接器 B-B CONN FOR HI SPEED TRANSMISSION RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點(diǎn)數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| IT1A-252P-SV | 制造商:HRS 制造商全稱:HRS 功能描述:High Speed, Matched-Impedance, Parallel Board-to-board Connector |
| IT1A-252S-SV | 功能描述:板對(duì)板與夾層連接器 B-B CONN FOR HI SPEED TRANSMISSION RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點(diǎn)數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| IT1A-252S-SV(25) | 功能描述:板對(duì)板與夾層連接器 B-B CONN FOR HI SPEED TRANSMISSION RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點(diǎn)數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| IT1LPMB-C | 制造商:Ideal Industries Inc 功能描述:LOW PROFILE MOUNT, #8SCRW,NAT |
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