參數(shù)資料
型號: IT1A-252S-SV
廠商: Hirose Electric USA, INC.
英文描述: High Speed, Matched-Impedance, Parallel Board-to-board Connector System
中文描述: 高速,匹配阻抗,平行板對板連接器系統(tǒng)
文件頁數(shù): 1/17頁
文件大小: 1081K
代理商: IT1A-252S-SV
1
High Speed, Matched-Impedance, Parallel Board-to-board Connector System
IT1 Series
NEW
2004.8
I
Features
1. Impedance Matching using a 4-Layer Board
The innovative transmission module uses PC boards
with a strip line design of transmission lines, providing
matched impedance of 50 ohms, for standard product.
2. Supports Multiple Connectors per board
Designed with a tolerance of +/- 0.2mm for both the X
and Y-axis. The three-piece structure and the +/- 0.2mm
tolerance allows 3 or more IT1’s to be mounted on a
single board.
3. Customized Board-to-Board Distance
Board-to-board distance can be customized, from 16mm
to 40mm.
Ground lines or additional traces can be added to
support high level, high speed transmission or mixed
power/signal applications.
4. Signal to Ground Ratio
The standard signal-to-ground ratio is 10:2, which makes
reliable matching of the characteristic impedance of each
transmission line. This ratio also can be customized.
5. Contact Reliability
Use of double contact points on each of the contacts
assures highly reliable performance.
I
Applications
Routers, servers, base stations and other
telecommunication equipment.
IT1 Series Outline
High-speed matched-impedance parallel board-to-board
connector designed for applications requiring board-to-
board spacing with transmission speeds exceeding
1GHz. The connection system has matched impedance
of 50 ohm or can be customized. Contacts are on 0.5mm
pitch.
4-Layer board
(Impedance matching)
2-Point contact
2-Point contact
(
(
Receptacle
Transmission Module
Receptacle
G
Connection Cross-Sectional Diagram
Receptacle (2 required)
Transmission Module
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