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參數(shù)資料
| 型號： | ISL90843WIU1027Z-TK |
| 廠商： | Intersil |
| 文件頁數(shù)： | 2/10頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP 256-TAP 10OHM 10-MSOP |
| 標準包裝： | 1,000 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 電阻（歐姆）： | 10k |
| 電路數(shù)： | 4 |
| 存儲器類型： | 易失 |
| 接口： | I²C（設(shè)備位址） |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 10-MSOP |
| 包裝： | 帶卷 (TR) |
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8095.2
March 29, 2006
ISL90843
MSOP Packaging Information
10 Lead MSOP, Package Code
1 2 3 45
0.0197 [0.50] BSC
0.1970 [5.00]
(S)
0.1890 [4.80]
10 9 8 76
0.0374 [0.95]
0.0295 [0.75]
4
0.0059 [0.15]
(S)
0.0020 [0.05]
0.0433 [1.10] MAX.
0.0039 [0.10]
MAX. (S)
0.0106 [0.27]
0.0067 [0.17]
2
0.1220 [3.10]
0.1142 [2.90]
0.0098 [0.25]
A
0°-6°
3
0.1220 [3.10]
0.1142 [2.90]
SECTION A-A
GAUGE PLANE
0.1220 [3.10]
0.1142 [2.90]
BASE
4
0.0106 [0.27]
0.0067 [0.17]
WITH
PLATING
0.0050 [0.127]
0.0091 [0.23]
0.0051 [0.13]
WITH PLATING
0.0080 [0.203]
REF
METAL
NOTES:
1. Package dimensions conform to JEDEC specification MO-187BA.
2.
Does not include mold flash, protrusion
or gate burrs, mold flash protrusions
or gate burrs shall not exceed 0.15 mm per side.
3.
Does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side.
4.
Does not include dambar protrusion. Allowable dambar protrusion shall be 0.8 mm.
5. Lead span/stand-off height/coplanarity are considered as special characteristics.
6. Controlling dimensions in inches [mm].
2
3
4
3
0.0276 [0.70]
0.0157 [0.40]
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