參數(shù)資料
型號: ISL6535IBZ
廠商: INTERSIL CORP
元件分類: 穩(wěn)壓器
英文描述: Synchronous Buck Pulse-Width Modulator (PWM) Controller
中文描述: SWITCHING CONTROLLER, 1500 kHz SWITCHING FREQ-MAX, PDSO14
封裝: ROHS COMPLIANT, PLASTIC, MS-012AB, SOIC-14
文件頁數(shù): 8/14頁
文件大?。?/td> 397K
代理商: ISL6535IBZ
8
FN9255.0
January 17, 2006
Determine the overcurrent trip point greater than the
maximum output continuous current at maximum inductor
ripple current.
High Speed MOSFET Gate Driver
The integrated driver has the same drive capability and
feature as the Intersil’s 12V gate driver, ISL6612. The PWM
tri-state feature
helps prevent a negative transient on the
output voltage when the output is being shut down. This
eliminates the Schottky diode that is used in some systems
for protecting the microprocessor from reversed-output-
voltage damage. See the ISL6612 datasheet for
specification parameters that are not defined in the current
ISL6535 electrical specifications table
.
Reference Input
The REFIN pin allows the user to bypass the internal 0.597V
reference with an external reference. If REFIN is NOT above
~2.2V, the external reference pin is used as the control
reference instead of the internal 0.597V reference. When not
using the external reference option the REFIN pin should be
left floating. An internal 6
μ
A pull-up keeps this REFIN pin
above 2.2V in this situation.
Internal Reference and System Accuracy
The Internal Reference is set to 0.597V. The total DC
system accuracy of the system is to be within 1.0% over
commercial temperature range and 1.5% over the industrial
temperature range. System Accuracy includes Error
Amplifier offset, and Reference Error. The use of REFIN may
add up to 3mV of offset error into the system (as the Error
Amplifier offset is trimmed out via the internal System
reference.)
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to
another can generate voltage transients across the
impedances of the interconnecting bond wires and circuit
traces. These interconnecting impedances should be
minimized by using wide, short printed circuit traces. The
critical components should be located as close together as
possible using ground plane construction or single point
grounding.
A multi-layer printed circuit board is recommended. Figure 5
shows the critical components of the converter. Note that
capacitors C
IN
and C
OUT
could each represent numerous
physical capacitors. Dedicate one solid layer, usually a
middle layer of the PC board, for a ground plane and make
all critical component ground connections with vias to this
layer. Dedicate another solid layer as a power plane and
break this plane into smaller islands of common voltage
levels. Keep the metal runs from the PHASE terminals to the
output inductor short. The power plane should support the
input power and output power nodes. Use copper filled
polygons on the top and bottom circuit layers for the phase
nodes. Use the remaining printed circuit layers for small
signal wiring.
Locate the ISL6535 within 2 to 3 inches of the MOSFETs, Q1
and Q2 (1 inch or less for 500kHz or higher operation). The
R
OCSET
I
OC_SOURCE
---------------------------------------------------------------------------------
I
----
+
r
)
HSOC
U
=
N
U
NUMBER OF HIGH SIDE MOSFETs
=
R
OCSET
I
---------------------------------------------------------------
r
)
=
Simple OCP Equation
Detailed OCP Equation
I =
V
- V
SW
OUT
---------------------------------
V
IN
---------------
F
SW
Regulator Switching Frequency
=
V
OUT
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
L
OUT
C
OUT
C
IN
VIN
KEY
FIGURE 5. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
VIA CONNECTION TO GROUND PLANE
L
Q
1
Q
2
+12V
C
BP_VCC
C
BP_PVCC
C
IN
C
SS
ISL6535
UGATE
PHASE
GND
PVCC
LGATE
VCC
BOOT
SS
PGND
TRACE SIZED FOR 3A PEAK CURRENT
SHORT TRACE, MINIMUM IMPEDANCE
ISL6535
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