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參數(shù)資料
| 型號(hào)： | ISL6532ACR |
| 廠商： | INTERSIL CORP |
| 元件分類(lèi)： | 穩(wěn)壓器 |
| 英文描述： | ACPI Regulator/Controller for Dual Channel DDR Memory Systems |
| 中文描述： | 3 A SWITCHING CONTROLLER, 280 kHz SWITCHING FREQ-MAX, PQCC28 |
| 封裝： | 6 X 6 MM, PLASTIC, MO-220VJJC, QFN-28 |
| 文件頁(yè)數(shù)： | 11/16頁(yè) |
| 文件大?。?/td> | 504K |
| 代理商： | ISL6532ACR |
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11
Application Guidelines
Layout Considerations
Layout is very important in high frequency switching
converter design. With power devices switching efficiently at
250kHz, the resulting current transitions from one device to
another cause voltage spikes across the interconnecting
impedances and parasitic circuit elements. These voltage
spikes can degrade efficiency, radiate noise into the circuit,
and lead to device over-voltage stress. Careful component
layout and printed circuit board design minimizes these
voltage spikes.
As an example, consider the turn-off transition of the control
MOSFET. Prior to turn-off, the MOSFET is carrying the full
load current. During turn-off, current stops flowing in the
MOSFET and is picked up by the lower MOSFET. Any
parasitic inductance in the switched current path generates a
large voltage spike during the switching interval. Careful
component selection, tight layout of the critical components,
and short, wide traces minimizes the magnitude of voltage
spikes.
There are two sets of critical components in the ISL6532A
switching converter. The switching components are the most
critical because they switch large amounts of energy, and
therefore tend to generate large amounts of noise. Next are
the small signal components which connect to sensitive
nodes or supply critical bypass current and signal coupling.
A multi-layer printed circuit board is recommended. Figure 4
shows the connections of the critical components in the
converter. Note that capacitors C
IN
and C
OUT
could each
represent numerous physical capacitors. Dedicate one solid
layer, usually a middle layer of the PC board, for a ground
plane and make all critical component ground connections
with vias to this layer. Dedicate another solid layer as a
power plane and break this plane into smaller islands of
common voltage levels. Keep the metal runs from the
PHASE terminals to the output inductor short. The power
plane should support the input power and output power
nodes. Use copper filled polygons on the top and bottom
circuit layers for the phase nodes. Use the remaining printed
circuit layers for small signal wiring. The wiring traces from
the GATE pins to the MOSFET gates should be kept short
and wide enough to easily handle the 1A of drive current.
In order to dissipate heat generated by the internal V
TT
LDO,
the ground pad, pin 29, should be connected to the internal
ground plane through at least four vias. This allows the heat
to move away from the IC and also ties the pad to the ground
plane through a low impedance path.
The switching components should be placed close to the
ISL6532A first. Minimize the length of the connections
between the input capacitors, C
IN
, and the power switches
by placing them nearby. Position both the ceramic and bulk
input capacitors as close to the upper MOSFET drain as
possible. Position the output inductor and output capacitors
between the upper and lower MOSFETs and the load.
The critical small signal components include any bypass
capacitors, feedback components, and compensation
components. Place the PWM converter compensation
components close to the FB and COMP pins. The feedback
resistors should be located as close as possible to the FB
pin with vias tied straight to the ground plane as required.
Feedback Compensation - PWM Buck Converter
Figure 5 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage
(V
OUT
) is regulated to the Reference voltage level. The error
amplifier output (V
E/A
) is compared with the oscillator (OSC)
triangular wave to provide a pulse-width modulated (PWM)
wave with an amplitude of V
IN
at the PHASE node.
V
DDQ
5VSBY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
L
OUT
C
OUT1
C
IN
V
IN_DDR
KEY
COMP
ISL6532A
UGATE
R
4
R
2
C
BP
FB
DRIVE2
GNDP
5VSBY
FIGURE 4. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
R
1
V
AGP
FB2
C
2
VIA CONNECTION TO GROUND PLANE
C
OUT3
L
L
Q
1
V
IN_AGP
R
5
R
6
PHASE
R
3
C
3
C
1
Q
2
12V
ATX
C
BP
GNDP
P12V
Q
3
LGATE
P5VSBY
VDDQ(3)
VTT(2)
C
OUT2
L
V
DDQ
V
TT
NCH
GND PAD
ISL6532A
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISL6532ACR-T | ACPI Regulator/Controller for Dual Channel DDR Memory Systems |
| ISL6532ACRZ | PWM Control Circuit 16-SOIC 0 to 70 |
| ISL6532ACRZ-T | PWM Control Circuit 16-SSOP 0 to 70 |
| ISL6532BCRZ-T | ACPI Regulator/Controller for Dual Channel DDR Memory Systems |
| ISL6532BCR-T | ACPI Regulator/Controller for Dual Channel DDR Memory Systems |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL6532ACR-T | 功能描述:IC REG/CTRLR ACPI DUAL DDR 28QFN RoHS:否 類(lèi)別:集成電路 (IC) >> PMIC - 電源管理 - 專(zhuān)用 系列:- 應(yīng)用說(shuō)明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| ISL6532ACRZ | 功能描述:DC/DC 開(kāi)關(guān)控制器 3-IN-1 DDRG W/NO OC FOR SPRINGDALE MBS RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開(kāi)關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| ISL6532ACRZ-T | 功能描述:DC/DC 開(kāi)關(guān)控制器 3-IN-1 DDRG W/NO OC SPRINGDALE MBS 28L RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開(kāi)關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| ISL6532ACRZ-TK | 功能描述:DC/DC 開(kāi)關(guān)控制器 3-IN-1 DDRG W/NO OC SPRINGDALE MBS 28L RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開(kāi)關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| ISL6532AEVAL1 | 功能描述:EVALUATION BOARD 1 ISL6532A RoHS:否 類(lèi)別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估板 - DC/DC 與 AC/DC（離線）SMPS 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:True Shutdown™ 主要目的:DC/DC，步升 輸出及類(lèi)型:1，非隔離 功率 - 輸出:- 輸出電壓:- 電流 - 輸出:1A 輸入電壓:2.5 V ~ 5.5 V 穩(wěn)壓器拓?fù)浣Y(jié)構(gòu):升壓 頻率 - 開(kāi)關(guān):3MHz 板類(lèi)型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
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