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參數(shù)資料
| 型號(hào)： | ISL6506BCBZ |
| 廠商： | INTERSIL CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Multiple Linear Power Controller with ACPI Control Interface |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 封裝： | ROHS COMPLIANT, PLASTIC, EPSOIC-8 |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大小： | 271K |
| 代理商： | ISL6506BCBZ |
6
simultaneously. The DLA pin is forced to a high impedance
state which allows the 12V rail to enhance the two N-
MOSFETs (Q
1
and Q
3
) that connect the ATX rails to the
3.3V
DUAL
and 5V
DUAL
rails. The 5VDLSB pin is forced to a
high impedance state which will turn the P-MOSFET (Q
2
)
off. Finally, the internal LDO which regulates the 3.3V
DUAL
rail in sleep states is put in standby mode.
Internal Linear Regulator Undervoltage Protection
The undervoltage protection on the internal linear regulator
is only active during sleep states and after the initial soft start
ramp of the 3.3V linear regulator. The undervoltage trip point
is set at 25% below nominal, or 2.475V.
When an undervoltage is detected, the 3.3V linear regulator
is disabled. One soft start interval later, the 3.3V linear
regulator is retried with a soft start ramp. If the linear
regulator is retried 3 times and a fourth undervoltage is
detected, then the 3.3V linear regulator is disabled and can
only be reset through a POR reset.
Internal Linear Regulator Over Current Protection
When an overcurrent condition is detected, the gate voltage
to the internal NMOS pass element is reduced which causes
the output voltage of the linear regulator to be reduced.
When the output voltage is reduced to the undervoltage trip
point, the undervoltage protection is initiated and the output
will shutdown.
Layout Considerations
The typical application employing an ISL6506 is a fairly
straight forward implementation. Like with any other linear
regulator, attention has to be paid to the few potentially
sensitive small signal components, such as those connected
to sensitive nodes or those supplying critical bypass current.
The power components (pass transistors) and the controller
IC should be placed first. The controller should be placed in
a central position on the motherboard, not excessively far
from the 3.3V
DUAL
island or the I/O circuitry. Ensure the
3V3AUX connection is properly sized to carry 1A without
exhibiting significant resistive losses at the load end.
Similarly, the input bias supply (5V
SB
) carries a similar level
of current - for best results, ensure it is connected to its
respective source through an adequately sized trace and is
properly decoupled. The pass transistors should be placed
on pads capable of heatsinking matching the device’s power
dissipation. Where applicable, multiple via connections to a
large internal plane can significantly lower localized device
temperature rise.
Placement of the decoupling and bulk capacitors should
reflect their purpose. As such, the high-frequency
decoupling capacitors should be placed as close as possible
to the load they are decoupling; the ones decoupling the
controller close to the controller pins, the ones decoupling
the load close to the load connector or the load itself (if
embedded). Even though bulk capacitance (aluminum
electrolytics or tantalum capacitors) placement is not as
critical as the high-frequency capacitor placement, having
these capacitors close to the load they serve is preferable.
Locate all small signal components close to the respective
pins of the control IC, and connect them to ground, if
applicable, through a via placed close to the ground pad.
A multi-layer printed circuit board is recommended.
Figure 5 shows the connections to most of the components
in the circuit. Note that the individual capacitors shown each
could represent numerous physical capacitors. Dedicate one
solid layer for a ground plane and make all critical
component ground connections through vias placed as close
to the component terminal as possible. The EPAD should be
tied to the ground plane with three to five vias for good
thermal management. Dedicate another solid layer as a
power plane and break this plane into smaller islands of
common voltage levels. Ideally, the power plane should
support both the input power and output power nodes. Use
copper filled polygons on the top and bottom circuit layers to
create power islands connecting the filtering components
(output capacitors) and the loads. Use the remaining printed
circuit layers for small signal wiring.
FIGURE 5. PRINTED CIRCUIT BOARD ISLANDS
Q2
Q3
12VATX
CIN
VIA CONNECTION TO GROUND PLANE
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT/POWER PLANE LAYER
ISL6506/A/B
GND
5VDLSB
KEY
VCC
5VSB
DLA
Q4
C
5V
L
C
5VSB
L
C
HF3V
C
HF5V
5VATX
+3.3VIN
3V3AUX
C
3V
5VDUAL
3V3DUAL
EPAD
ISL6506, ISL6506A, ISL6506B
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL6506BCBZA | 功能描述:DC/DC 開(kāi)關(guān)控制器 W/ANNEAL 2 OUTPUT ACPI PWR CNTRLR 8LD RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開(kāi)關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| ISL6506BCBZA-T | 功能描述:DC/DC 開(kāi)關(guān)控制器 W/ANNEAL 2 OUTPUT ACPI CNTRLR 8L EP RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開(kāi)關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| ISL6506BCBZ-T | 功能描述:DC/DC 開(kāi)關(guān)控制器 2 OUTPUT ACPI CNTRLR 8L EP RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開(kāi)關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| ISL6506BIBZ | 功能描述:IC CTRLR PWR ACPI 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:控制器，DSP 輸入電壓:4.5 V ~ 25 V 輸出數(shù):2 輸出電壓:最低可調(diào)至 1.2V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:30-TFSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:30-TSSOP 包裝:帶卷 (TR) |
| ISL6506BIBZ-T | 功能描述:IC CTRLR PWR ACPI 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:控制器，DSP 輸入電壓:4.5 V ~ 25 V 輸出數(shù):2 輸出電壓:最低可調(diào)至 1.2V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:30-TFSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:30-TSSOP 包裝:帶卷 (TR) |
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