參數(shù)資料
型號(hào): ISL6208CRZ-T
廠商: INTERSIL CORP
元件分類: 功率晶體管
英文描述: Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-PDIP -40 to 85
中文描述: 4 A HALF BRDG BASED MOSFET DRIVER, PQCC8
封裝: 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, QFN-8
文件頁數(shù): 3/10頁
文件大?。?/td> 325K
代理商: ISL6208CRZ-T
3
ti
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
BOOT Voltage (V
BOOT
). . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
Phase Voltage (V
PHASE
)
(Note 1). . . V
BOOT
- 7V to V
BOOT
+ 0.3V
Input Voltage (V
FCCM
, V
PWM
) . . . . . . . . . . . . -0.3V to VCC + 0.
3V
UGATE. . . . . . . . . . . . . . . . . . . . . .V
PHASE
- 0.3V to V
BOOT
+ 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
Ambient Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to 125°C
Recommended Operating Conditions
Ambient Temperature Range
. . . . . . . . . . . . . . . . . . .-10
°
C to 100
°
C
Maximum Operating Junction Temperature. . . . . . . . . . . . . . 125
°
C
Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
±
10
%
Thermal Resistance (Typical Notes 2, 3, 4)
θ
JA
(°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
QFN Package (Notes 3, 4). . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . .150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300°C
(SOIC - Lead Tips Only)
θ
JC
(°C/W)
n/a
15
110
80
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For
θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Bias Supply Current
I
VCC
PWM pin floating, V
FCCM
= 5V
-
80
-
μ
A
POR
-
-
-
Vcc Rising
-
3.40
3.90
V
Vcc Falling
2.40
2.90
-
V
Hysteresis
-
500
-
mV
BOOTSTRAP DIODE
Forward Voltage
V
F
V
VCC
= 5V, forward bias current = 2mA
0.40
0.52
0.60
V
PWM INPUT
Input Current
I
PWM
V
PWM
= 5V
-
250
-
μ
A
V
PWM
= 0V
-
-250
-
μ
A
PWM Three-State Rising Threshold
V
VCC
= 5V
0.70
1.00
1.30
V
PWM Three-State Falling Threshold
V
VCC
= 5V
3.5
3.8
4.1
V
Three-State Shutdown Holdoff Time
t
TSSHD
V
VCC
= 5V, temperature = 25°C
100
175
250
ns
FCCM INPUT
FCCM LOW Threshold
0.50
-
-
V
FCCM HIGH Threshold
-
-
2.0
V
SWITCHING TIME
UGATE Rise Time
t
RU
V
VCC
= 5V, 3nF Load
-
8.0
-
ns
LGATE Rise Time
t
RL
V
VCC
= 5V, 3nF Load
-
8.0
-
ns
UGATE Fall Time
t
FU
V
VCC
= 5V, 3nF Load
-
8.0
-
ns
LGATE Fall Time
t
FL
V
VCC
= 5V, 3nF Load
-
4.0
-
ns
ISL6208
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