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參數(shù)資料
| 型號： | ISL5585ECRZ-TK |
| 廠商： | Intersil |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SLIC RINGING 3.3V VOB 32-QFN |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 功能： | 用戶線路接口概念（SLIC） |
| 電路數(shù)： | 1 |
| 電源電壓： | 3.3V |
| 功率（瓦特）： | 305mW |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN（7x7） |
| 包裝： | 帶卷 (TR) |
| 包括： | 均衡和不均衡振鈴，振鈴聲信號發(fā)生器，熱關(guān)機(jī)，帶警報(bào)指示器 |
23
ISL5585
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
INDEX
D1/2
D1
D/2
D
E1/2
E/2
E
A
2X
0.15
B
C
0.10
B
A
MC
A
N
SEATING PLANE
N
6
3
2
3
e
1
0.08
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
C
SECTION "C-C"
NX b
A1
C
2X
C
0.15
2X
B
0
REF.
(Nd-1)Xe
(Ne-1)Xe
REF.
5
A1
4X P
A
C
4X P
B
2X
A
C
0.15
A2
A3
D2
E2
E2/2
TERMINAL TIP
SIDE VIEW
TOP VIEW
7
BOTTOM VIEW
7
5
C
L
C
L
e
E1
2
NX k
NX b
8
NX L
8
9
AREA
9
4X
0.10 C
/ /
9
(DATUM B)
(DATUM A)
AREA
INDEX
6
AREA
N
9
CORNER
OPTION 4X
L1
L
10
L1
L
10
L32.7x7
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VKKC ISSUE C)
SYMBOL
MILLIMETERS
NOTES
MIN
TYP
MAX
A
0.80
0.90
1.00
-
A1
-
0.05
-
A2
-
1.00
9
A3
0.20 REF
9
b
0.23
0.28
0.38
5, 8
D
7.00 BSC
-
D1
6.75 BSC
9
D2
4.55
4.70
4.85
7, 8
E
7.00 BSC
-
E1
6.75 BSC
9
E2
4.55
4.70
4.85
7, 8
e
0.65 BSC
-
k
0.25
---
L
0.50
0.60
0.75
8
L1
-
0.15
10
N32
2
Nd
8
3
Ne
8
3
P-
-
0.60
9
θ
--
12
9
Rev. 4 8/03
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present
when Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
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