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參數(shù)資料
| 型號： | ISL55110 |
| 廠商： | Intersil Corporation |
| 英文描述： | Dual, High Speed MOSFET Driver |
| 中文描述： | 雙路，高速MOSFET驅(qū)動器 |
| 文件頁數(shù)： | 3/15頁 |
| 文件大?。?/td> | 313K |
| 代理商： | ISL55110 |
3
FN6228.1
March 21, 2007
Absolute Maximum Ratings
(T
A
= +25°C)
VH+ to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.0V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
VIN_A, VIN_V, PDN, ENABLE. . . . . . . . (GND-0.5V) to (VDD+0.5V)
OA, OB. . . . . . . . . . . . . . . . . . . . . . . . . . . . .(GND-0.5) to (VH+0.5V)
Maximum Peak Output Current . . . . . . . . . . . . . . . . . . . . . . (300mA)
ESD HBM Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3KV
Thermal Information
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Thermal Resistance
16 Ld (4x4) QFN Package (Note 2) . . . . . . . . . . . . .
8 Ld TSSOP Package (Note 1) . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
(Lead Tips Only)
θ
JA
(°C/W)
45
140
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: T
J
= T
C
= T
A
NOTES:
1.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Recommended Operating Conditions
PARAMETER
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
VH
Driver Supply Voltage
5
12
13.2
V
VDD
Logic Supply Voltage
2.7
5.5
V
T
A
Ambient Temperature
-40
+85
°C
T
J
Junction Temperature
+150
°C
DC Electrical Specifications
VH = +12V, VDD = 2.7V to 5.5V, T
A
= +25°C, unless otherwise specified.
PARAMETER
DESCRIPTION
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC CHARACTERISTICS
VIX_LH
Logic Input Threshold - Low to High
l
IH
= 1μA: VIN_A, VIN_B
1.32
1.42
1.52
V
VIX_HL
Logic Input Threshold - High to Low
l
IL
= 1μA: VIN_A, VIN_B
1.12
1.22
1.32
V
VHYS
Logic Input Hysteresis
VIN_A,VIN_B
0.2
V
VIH
Logic Input High Threshold
PDN
2.0
VDD
V
VIL
Logic Input Low Threshold
PDN
0
0.8
V
VIH
Logic Input High Threshold
ENABLE - QFN only
2.0
VDD
V
VIL
Logic Input Low Threshold
ENABLE - QFN only
0
0.8
V
IIX_H
Input Current Logic High
VIN_A,VIN_B = VDD
10
20
nA
IIX_L
Input Current Logic Low
VIN_A, VIN_B = 0V
10
20
nA
II_H
Input Current Logic High
PDN = VDD
10
20
nA
II_L
Input Current Logic Low
PDN = 0V
10
15
nA
II_H
Input Current Logic High
ENABLE = VDD - QFN only
12
mA
II_L
Input Current Logic Low
ENABLE = 0V - QFN only
-25
nA
ISL55110, ISL55111
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