參數(shù)資料
型號(hào)： ISL3873
廠商： Intersil Corporation
元件分類： 基帶處理器
英文描述： Wireless LAN Integrated Medium Access Controller with Baseband Processor
中文描述： 集成的無(wú)線局域網(wǎng)媒體訪問(wèn)控制器基帶處理器
文件頁(yè)數(shù)： 31/31頁(yè)
文件大小： 215K
代理商： ISL3873
31
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
2401 Palm Bay Rd., Mail Stop 53-204
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil Ltd.
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: 886-2-2515-8508
FAX: 886-2-2515-8369
ISL3873
Plastic Ball Grid Array Packages (BGA)
o
TOP VIEW
D
A1
BOTTOM VIEW
P
R
T
N
L
M
J
K
G
H
F
E
8
13
14
121110 9
CORNER
7 6 5
3
4
2
C
D
A
B
1
SIDE VIEW
SEATING PLANE
C
A
A1
A2
bbb
C
aaa
A1
E
A
B
E1
D1
b
S
ALL ROWS AND COLUMNS
S
M
A B
C
C
0.15
0.006
0.08
0.003
M
A1
A1
CORNER I.D.
e
A
A
C
15
16
CORNER
CORNER I.D.
V192.14x14
192 BALL PLASTIC BALL GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.059
-
1.40
-
A1
0.012
0.016
0.31
0.41
-
A2
0.033
0.039
0.83
0.99
-
b
0.016
0.020
0.41
0.51
7
D/E
0.547
0.555
13.90
14.10
-
D1/E1
0.468
0.476
11.90
12.10
-
N
192
192
-
e
0.032 BSC
0.80 BSC
-
MD/ME
16 x 16
16 x 16
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
Rev. 1 1/01
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. DimensioningandtolerancingconformtoASMEY14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
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